Meiqin Li
at Focuslight Technologies Inc
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 21 February 2020 Presentation + Paper
Proceedings Volume 11261, 112610C (2020) https://doi.org/10.1117/12.2540399
KEYWORDS: Packaging, High power lasers, Semiconductor lasers, Continuous wave operation, Laser bonding, Resistance

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