Mr. Michael J. Cicoria Profile

Michael J. Cicoria

at Northrop Grumman Corp

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 28 March 2014 Paper

Towards electrical testable SOI devices using Directed Self-Assembly for fin formation

Chi-Chun Liu, Cristina Estrada-Raygoza, Hong He, Michael Cicoria, Vinayak Rastogi, Nihar Mohanty, Hsinyu Tsai, Anthony Schepis, Kafai Lai, Robin Chao, Derrick Liu, Michael Guillorn, Jason Cantone, Sylvie Mignot, Ryoung-Han Kim, Joy Cheng, Melia Tjio, Akiteru Ko, David Hetzer, Mark Somervell, Matthew Colburn

Proceedings Volume 9049, 904909 (2014) https://doi.org/10.1117/12.2046462

KEYWORDS: Etching, Silicon, Polymethylmethacrylate, Semiconducting wafers, Scatterometry, Image processing, 3D modeling, Line edge roughness, Defect detection, Directed self assembly

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Proceedings Article | 27 March 2014 Paper

Manufacturability considerations for DSA

Richard Farrell, Erik Hosler, Gerard Schmid, Ji Xu, Moshe Preil, Vinayak Rastogi, Nihar Mohanty, Kaushik Kumar, Michael Cicoria, David Hetzer, Anton DeVilliers

Proceedings Volume 9051, 90510Z (2014) https://doi.org/10.1117/12.2048396

KEYWORDS: Polymethylmethacrylate, Optical lithography, Photoresist materials, Line edge roughness, Etching, Line width roughness, Picosecond phenomena, Scanning electron microscopy, Annealing, Directed self assembly

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Proceedings Article | 29 March 2013 Paper

Feasibility study of resist slimming for SIT

Nicole Saulnier, Chiew-seng Koay, Matthew Colburn, David Hetzer, Michael Cicoria, Jonathan Ludwicki

Proceedings Volume 8682, 86820E (2013) https://doi.org/10.1117/12.2011506

KEYWORDS: Etching, Lithography, Photoresist processing, Critical dimension metrology, Semiconducting wafers, Line width roughness, Line edge roughness, Scanning electron microscopy, Double patterning technology, Chemical reactions

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Proceedings Article | 26 March 2013 Paper

Directed self-assembly process implementation in a 300mm pilot line environment

Chi-Chun Liu, I. Cristina Estrada-Raygoza, Jassem Abdallah, Steven Holmes, Yunpeng Yin, Anthony Schepis, Michael Cicoria, David Hetzer, Hsinyu Tsai, Michael Guillorn, Melia Tjio, Joy Cheng, Mark Somervell, Matthew Colburn

Proceedings Volume 8680, 86801G (2013) https://doi.org/10.1117/12.2011610

KEYWORDS: Critical dimension metrology, Etching, Line width roughness, Semiconducting wafers, Optical lithography, Lithography, Chemical reactions, Photoresist processing, Polymethylmethacrylate, Directed self assembly

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Proceedings Article | 26 March 2013 Paper

Fabrication of 28nm pitch Si fins with DSA lithography

Gerard Schmid, Richard Farrell, Ji Xu, Chanro Park, Moshe Preil, Vidhya Chakrapani, Nihar Mohanty, Akiteru Ko, Michael Cicoria, David Hetzer, Mark Somervell, Benjamen Rathsack

Proceedings Volume 8680, 86801F (2013) https://doi.org/10.1117/12.2011607

KEYWORDS: Optical lithography, Etching, Silicon, Photoresist materials, Finite element methods, Picosecond phenomena, Coating, Polymethylmethacrylate, Lithography, Directed self assembly

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