Laser activation annealing using of an Mg-doped GaN four-point probe small mesa device using a 193-nm ArF excimer laser is investigated. Fabricated mesa device has 2-μm-high small mesa structures with In/Au contacts formed using standard semiconductor device process. In our setup, the ArF excimer laser was directed onto the sample using a series of mirrors and was focused through an aspheric lens to the sample, which is mounted on to a movable stage. The mesa device and the laser were aligned while being viewed on the computer monitor screen using a UV CCD camera. This method has several merits: (1) the four-point probe measurement allows accurate resistivity measurement of the GaN layer independently of the contact resistance, (2) utilizing a small area mesa also as the alignment marker during laser annealing ensures that the irradiated area precisely corresponds to the resistivity measurement area, and (3) multiple irradiation-measurement cycles are possible with a single mesa device, which avoids wafer-scale variations. The dependence of the resistivity to the laser fluence and irradiation time were investigated by multiple-irradiation measurement cycles to a single mesa device in combination with atomic force microscopy analysis for surface morphology characterization. Results reveal that laser annealing at 530 mJ/cm2 for 1500 s (at 150 Hz repetition rate) decreases the resistivity from 11.5 (before irradiation) to 5.6 Ω·cm (after irradiation). This value is similar to resistivity achieved by rapid thermal annealing (RTA) at 800°C for 120 s, suggesting successful Mg-doped GaN activation. Results also show stronger dependence on the irradiation time (temporal dependence) than the laser fluence, which may imply that activation mechanism for the laser annealing has a thermal contribution. This is the first report demonstrating ArF laser annealing that achieves a similar degree of activation with conventional RTA using resistivity measurements.
In this study, ArF laser activation annealing of an Mg-doped GaN four-point probe small mesa device is investigated. Fabricated mesa device has 2-μm-high small mesa structures with In/Au contacts formed using standard semiconductor device process. In our setup, the ArF excimer laser was directed onto the sample using a series of mirrors and was focused through an aspheric lens to the sample, which is mounted on to a movable stage. The mesa device and the laser were aligned while being viewed on the computer monitor screen using a UV CCD camera. The dependence of the resistivity to the laser fluence and irradiation time were investigated by multiple-irradiation measurement cycles to a single mesa device. Results reveal that laser annealing at 530 mJ/cm2 for 25 min (at 150 Hz repetition rate) decreases the resistivity from 11.5 (before irradiation) to 5.6 Ω·cm (after irradiation). This value is comparable to resistivity achieved by RTA at 800 ◦C for 2 min, suggesting successful Mg-doped GaN activation.
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