Mr. Paul McCann Profile

Paul McCann

at Analog Devices Belfast Ltd

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Author

Publications (3)

Proceedings Article | 27 August 2003 Paper

Fusion-bonded mutilayered SOI for MEMS applications

David Cole, Cormac McNamara, Kumar Somasundram, Anne Boyle, Claire Devine, James McKeever, Paul McCann, Andrew Nevin

Proceedings Volume 4876, (2003) https://doi.org/10.1117/12.463926

KEYWORDS: Oxides, Semiconducting wafers, Interfaces, Etching, Silicon, Annealing, Wafer bonding, Scanning electron microscopy, HF etching, Platinum

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Proceedings Article | 24 April 2003 Paper

Fusion-bonded multilayered SOI for MEMS applications

Kumaresa Somasundram, David Cole, Cormac McNamara, Anne Boyle, Paul McCann, Claire Devine, Andrew Nevin

Proceedings Volume 5116, (2003) https://doi.org/10.1117/12.502741

KEYWORDS: Oxides, Low pressure chemical vapor deposition, Semiconducting wafers, Multilayers, Microelectromechanical systems, Silicon, Polishing, Wafer bonding, Tungsten, Etching

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Proceedings Article | 28 September 2001 Paper

Conformal deposition of LPCVD TEOS

Paul McCann, Kumar Somasundram, Stephen Byrne, Andrew Nevin

Proceedings Volume 4557, (2001) https://doi.org/10.1117/12.442963

KEYWORDS: Low pressure chemical vapor deposition, Oxides, Annealing, Microelectromechanical systems, Ozone, FT-IR spectroscopy, Semiconducting wafers, Diffractive optical elements, Silicon, Analog electronics

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