We are developing a 1x8 single mode (SM) optical interface to facilitate the adoption of dense wavelength division multiplexing (DWDM) silicon photonic (SiPh) optical interconnects in exascale computing systems. A common method for fiber attachment to SiPh transceivers is ‘pigtailing’- the permanent adhesive bonding of fiber/v-groove arrays to onchip grating couplers (GC). This approach precludes standard high throughput surface mounting and solder reflow assembly of the transceiver onto system printed circuit boards. Our approach replaces the fixed pigtail with a low profile, small form factor, detachable expanded beam optical connector which consists of four essential parts: a GC array, a surface mount glass microlens array chip, an injection molded solder reflowable optical socket, and an injection molded SM light turn ferrule. The optical socket and ferrule are supplied by US Conec Ltd. To design the GC, we developed an optical simulator that considers CMOS foundry constraints in the optimization process. On-wafer measurements of the GC coupling loss to SMF28 fiber at 1310nm is ~1.4dB with a 1dB bandwidth of ~22nm. This ensures a wide low loss spectral window for at least 16 DWDM channels. The geometry of the optical system is arranged so that only a simple spherical lens is required for efficient mode matching in the expanded beam space. The fiber to fiber insertion loss through the light turn ferrule, two microlenses and GCs, and a looped back SOI waveguide ranged from 4.1-6.3dB, with insertion loss repeatability of 0.2dB after multiple mating cycles.
The need for additional IO bandwidth for data center device interconnection is well established. Optical interconnects can deliver required bandwidth along with energy and space efficiency at a cost that encourages adoption. To this end, we are developing an optical transceiver incorporating multimode VCSEL emitters in a coarse wavelength division multiplex (CWDM) system capable of transmission at 25Gbps per channel, 100Gbps/fiber, and a maximum aggregate bidirectional data rate of 1.2Tbps. Electrical connection to the transceiver can be made by solder reflow or LGA connector, and optical connection is made by means of a custom optical connector supporting CWDM transmission.
A low cost, blind mate, injection molded optical backplane is presented. The optical backplane is comprised of 12
channel optical broadcast buses, operating at 10Gbps/channel with six blindmate optical output ports spaced 1U apart.
In this paper, we present an integrated fabrication process for realizing a switching/modulation mechanism for negative
index materials (NIMs) based on photoconductive coupling. The metamaterial element chosen is an array of regular
copper split-ring resonator (SRR) that was fabricated on two different substrates: high-resistivity silicon (HRS) and
fused silica glass. The switching mechanism proposed can be achieved through tuning the SRR gap and/or substrate
conductivity. The photosensitive material of the SRR structure (amorphous silicon for the glass substrate samples and
intrinsic silicon for the HRS substrate samples) upon illumination generates excess carriers that essentially shunt the gap
capacitance thus diminishing the resonance response significantly. The response in terms of S-parameters is simulated
using HFSS under varying magnitude of optical illumination. Our simulation with a single SRR to demonstrate total
suppression of resonance amplitude with a high extinction ratio is applicable to NIMs comprising of both negative
permeability and negative permittivity without any loss of generality. This method may provide a basis for long-sought
practical applications and devices based on NIM in the fields of ultra-fast communications at RF and optical
frequencies, sensing and imaging promising a potential of dramatically improving the performance of existing phased
array antennas, optical beam-forming networks, antenna remoting and transportation of RF power through fiber-radio.
Balanced electroabsorption modulators (B-EAM) are an attractive alternative to the cross-coupled Mach-Zehnder modulator. The B-EAM enables bias independent suppression of even-order distortions, relative intensity noise (RIN), and common amplified spontaneous emission noise. By biasing the B-EAM at the 3rd order null, a 5th order distortion limited spurious free dynamic range can be achieved. We report on the experimental demonstration of the simultaneous suppression of laser RIN, 2nd and 3rd order distortions using a 300 micrometers long B-EAM.
Conference Committee Involvement (1)
Nanomaterials Synthesis, Interfacing, and Integrating in Devices, Circuits, and Systems II
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