CONFERENCE PROCEEDINGS
Advanced Search
Sascha Bott
at GlobalFoundries
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 26 May 2022 Presentation + Paper
Wafer level analysis and simulation of back end of line chemical mechanical polishing processes
Ushasree Katakamsetty, Stefan Nikolaev Voykov, Sascha Bott, Sam Nakagawa, Tamba Tugbawa, Aaron Gower-Hall, Brian Lee, Jansen Chee, Henry Geng, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
Proceedings Volume 12052, 1205212 (2022) https://doi.org/10.1117/12.2616078
KEYWORDS: Chemical mechanical planarization, Semiconducting wafers, Data modeling, Calibration, Dysprosium, Back end of line, Polishing, Design for manufacturing, Metals, Chemical reactions
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top