This paper proposes dual-mode buffer direct injection (BDI) and direct injection (DI) readout circuit design. The DI readout circuit has the advantage of being a simple circuit, requiring a small layout area, and low power consumption. The internal resistance of the photodetector will affect the photocurrent injection efficiency. We used a buffer amplifier to design the BDI readout circuit since it would reduce the input impedance and raise the injection efficiency. This paper will discuss and analyze the power consumption, injection efficiency, layout area, and circuit noise. The circuit is simulated using a TSMC 0.35 um Mixed Signal 2P4M CMOS 5 V process. The dimension of the pixel area is 30×30 μm. We have designed a 10×8 array for the readout circuit of the interlaced columns. The input current ranges from 1 nA to 10 nA, when the measurement current is 10 pA to 10 nA. The integration time was varied. The circuit output swing was 2 V. The total root mean square noise voltage was 4.84 mV. The signal to noise ratio was 52 dB, and the full chip circuit power consumption was 9.94 mW.
This paper discusses a capacitor transimpedance amplifier (CTIA) designed for an infrared readout circuit. The CTIA has better gain control, high dynamic range, a stability bias point and low impedance. It applies a short-wave detector and small current source because input impedance is very small in an amplifier feedback mechanism. This research on a capacitor transimpedance amplifier (CTIA) is designed for an infrared readout circuit. It is designed, simulated and laid out using the TSMC 0.35um 2P4M CMOS 5V process. The clock rate operates at 3MHz. Layout area is 30umX30um and the array size is 20X16. The simulation current sets 0.01nA~1.3nA. The output swing is 2.8V and power consumption is 10.1 mW according to the measurement results.
This study proposes a solution for an excessive dark current by a sharing capacitor, which avoids output signal
distortion due to integration voltage saturation. Integration capacitance can be changed by adding a switch in the pixel
circuit, which will increase the capacitance by two times the original. This circuit also provides output functions of either
single-band or dual-band by switching to different sensor. This integrated readout circuit design adopts the TSMC
0.35um 2P4M CMOS 5V process, run on a 5V power supply and operated at a 3MHz clock rate. The dual-band pixel
circuit uses an interlace structure, the pixel circuit areas of the two wavelengths are both 30um x 30um. The mid-wave
and long-wave sensor currents are from 1nA to 2nA and 6nA to 8nA, respectively, and output swing is 2.8V.
This paper discusses about a readout circuit for Dual-Band Quantum Well Infrared Photo-detectors (DBQWIP)
interlaced focal plane array infrared image system. In this research, we will present the study of modified dark-current
cancellation circuit. The sensing photo-current from 1nA to 10nA of long-wave infrared signal, mid-wave infrared
photo-current is about 100pA to 1nA, the dark current is set up to 100nA. The area of unit pixel is 30×30μm2 . The 8×6
focal-plane array is designed by using TSMC 0.35μm 2P4M CMOS process. This work has 3.3V power supply and
readouts data at 2.5MHz clock rate. The simulated output voltage range of LWIR and MWIR photo-current are 0.95v and
0.76v, respectively.
For propose of achieving the high coherent quantum dots or the expected spectral emission, we have proposed the
epitaxial method solved by using self-organized grown on the InxGa1-xAs relaxed layer and the mis-orientated GaAs
substrates. In this study, using extra slow growth rate of 0.075ML/sec to grow the quantum dot matrix under the
temperature of 500°C by the general Riber 32P solid-source MBE system, the high surface density and uniformity in size
of two-stacked of quantum dot (QD) matrix have been established. The temperature dependences of the full widths at
half-maximum (FWHM) and the positions of photoluminescence (PL) bands are studied experimentally by adding
In0.1Ga0.9As surfactant layer and using mis-orientated substrate, respectively. The 3-dimensional QD images using
atomic force microscopy (AFM) well agree with the results of above mentioned. Therefore, a systematic estimate is
given of the QD structures grown on different epitaxial conditions.
In this work, the 30 stacked InAs/GaAs quantum dot infrared photodetector (QDIP) structure was grown by
solid-source molecular beam epitaxy technique and demonstrated with dual-band mid- (2.7~5.6μm) and long-
(7.5~13.5μm) wavelength normal-incident detections without grating and passivated process for 256×256 FPA. The 256
×256 QDIP FPA hybridized with snapshot-mode ROIC was mounted in a 68 pin leadless ceramic chip carrier which
was put in the testing dewar with IR optical cold spectral filters of the 2.9~5.5μm and 6.5~14.5 μm for the dual-band IR
detections, respectively. The testing scheme for thermal imaging uniformity of the InAs/GaAs QDIP focal plane array
(FPA) has been proposed and calibrated using a plane-typed blackbody source of a high temperature of 373±1K and
lower ambient temperature for the two-point temperature correction. The averaged of specific detectivity (D*) and
operability of the QDIP FPA have reached 1.5×1010cm-Hz1/2/W and 99% at 80K, respectively. The dominant noise
equivalent temperature differences (NEDT) of typical figure of merit for QDIP thermal imaging module operated under
the temperature of 80K, device biases of -0.7 V and integration time of 32ms with infrared optics and two-point
temperature correction (TL =R.T. and TH= 200 °C) are 1.065 K (mid-wavelength IR) and 131mK (long-wavelength IR),
respectively. Meanwhile, it is worth to note that these are the first confirmation for dual-band detections of FPA from
direct InAs quantum dots matrix embedded in GaAs heterostructure. In the future, the dual-band IR QDIP FPA will
become one of the important candidates for hyper-spectral detection and thermal imaging fusion application.
This paper mainly focuses on the simulation for temperature-dependent Distributed Bragg Reflector (DBR) of
850nm vertical cavity surface emitting laser (VCSEL) with Transmission Matrix (TMM), Matrix Calculating Methods
(MCM) and Macleod Model and performance for comparison with proton-implant/oxide confined process on VCSEL.
Using well-developed temperature-dependent DBR-reflectivity solver with Mathcad simulator, we have successfully
compared the Macleod Model simulator with theoretical self-developed solution based on the Transmission Matrix
(TMM), Matrix Calculating Methods (MCM) and find very good agreement with previous results while accounting for
influences of conjugated part of refractive index and graded Al compositions of DBR materials. Moreover,
optoelectronic performance of Proton-Implant/Oxide Confined 850nm VCSEL have been demonstrated on this paper
using temperature-dependent power output, voltage/injection current, transverse operating wavelengths, optical spectral
characteristics, slope efficiency and transverse optical modes with an approximated Marcatili's method extracted and
measurement from systematically measuring experiments. Through adequate and precise LD device design and
processes, we have proposed the high performance single-mode proton implanted in contrast to the oxide confined 850
nm VCSEL. Under nominal temperature-variety and keeping operating temperature of 30°C,the threshold voltage,
injecting current, peak-wavelength and differential resistance of the proton implanted VCSEL with the optical aperture in
the dimension of 10 &mgr;m are 1.8 V, 3.2 mA, 851 nm and 36.8 ohm, respectively.
KEYWORDS: Indium arsenide, Finite element methods, Gallium arsenide, Quantum dots, Luminescence, Heterojunctions, Transmission electron microscopy, Absorption, Gallium, Chemical elements
Electronic and optical properties of ideal and real quantum dots (QDs) are extensively studied and derived for the
recent decade. Strain caused by the differences of the lattice constants of dot and wetting, barrier materials are decisive
for both the self-assembly mechanisms and the electro-optical properties. The research is mainly investigated for
realizing the strain effects on the optical properties of InAs/GaAs self-assembled QDs embedded in GaAs barrier layer
incorporated with the three-dimensional (3D) Schördinger equation and solved by using finite element method (FEM).
From 3D QD geometrical profiles establishing by the spatially geometric equations, the confined electron and hole
bandstructures on altering sized lens and pyramidal shape-like QDs with numerical calculations and strained
heterostructure of the finite element approximations have been proposed. Applying the fast FEM models, it is
demonstrated that the correspondence of ground, excited eigenstates, the probability of density function (|Ψ|2) of the
confined levels from the single InAs QD to a matrix of nine QDs to obtain the transition energy and coordinated
absorption wavelength to be predicted and summarized clearly.
Through calculating energy levels within the conduction and valence band edge confinement on the InAs/GaAs
heterostructure with FEM to contradistinguish with corrected to optical transitions and linear absorption spectra can be
achieved for verifying to being the specific wavelengths from photoluminescence (PL) and photoresponse (PR)
measurements for quantum dot infrared photodetector. By fitting the energy differences among the subbands, the
geometrical shape and size of QD can be predicted. Inducting the tendency from single QD to the matrix of 9 QDs, the
step-wise bands have been obtained being some regularity clearly. And from the transmission electron microscope (TEM)
measurement, the dominant sizes of QDs in the really grown wafer remain the consistent with the numerical analyses
applied in 3D QD profile that is interpreted using spatially geometric equations.
The noise characteristics associated with dark current, photoconductive gain (PC), capture probability in doped InAs dots embedded in In0.1Ga0.9As/GaAs spacer layer have been proposed. The photoconductive and photovoltaic behaviors of the InAs/GaAs quantum dot infrared photodetector (QDIP) from the intersubband transition measurements are also clearly observed. Through noise measurement in dynamic signal analyzer (HP35670A) 1, the electronic bandpass filter frequencies are set up ranging from 3 to 10 KHz in a low noise current preamplifier (SR570) 2. The lock-in amplifier (SR830) 3 can be also used to measure and calibrate the noise density by means of the mean average deviation (MAD) contrast with noise spectra from HP35670A. The InAs/GaAs QDIP studied in this work belongs to n+-n-n+ structure with the top and free blocking barrier layers. It is observed that the owing blocking layer of QDIP not only suppress dark
current successfully but also probably reduce the photocurrent 4-6. By systematically optoelectronic measurements and simulations, the modified model of noise current, photoconductive gain, and capture probability in the quantum devices have been proposed. It is shown that photoconductive gain is almost independent of bias under the lower bias, then increasing exponentially under higher bias and below the temperature of 80K. In contrast to quantum well infrared photodetector (QWIP), a higher photoconductive gain of the quantum dot infrared photodetector has been demonstrated and attributed to the longer lifetimes of excited carriers in quantum dots 7-10. At 80K, a photoconductive gain of tens of thousand is shown in the regions of higher biases. It is clear to note that the highest detectivity of the QDIP surprisingly approach to 3.0×1012 cmHz1/2/W at -0.6V under measured temperature 20 K. Under 80K, the average D* is obtained ~1010 cmHz1/2/W. To our knowledge, this is the one of highest D* data in the world.
The vertical cavity surface emitting laser (VCSEL) based on graded distributed Bragg reflectors (DBR) consisted of a top mirror of 20 pairs of AlxGa1-xAs/AlyGa1-yAs (x=0~0.9, y=0~0.12) quarter-wave stacks and a bottom mirror of 34 pairs of AlyGa1-yAs/AlxGa1-xAs quarter-wave stacks has been demonstrated. Using two proposed transfer matrix methods, the simulation of DBR reflectivity depending on temperature refractive index of AlxGa1-xAs and AlyGa1-yAs are discussed and investigated. The simulation results could be achieved to well predicted the DBR performance under operating temperature variances, i.e., the temperature on varying reflectivity and full width half maximum (FWHM), wavelength stop-band shifts of the laser reflector, where using the multi-layer films evolution software of essential Macleod and modified transfer matrix method, respectively. Under our simulation, assuming the physically VCSEL device feature such as the linear grading DBR structure sandwiched with a n-type GaAs substrate and air films, we have systematically studied the temperature effects on the key parameters of top and bottom DBR schemes. In contrast with the temperature dependent DBR on the 850nm-VCSEL characteristics simulated with the above two transfer methods, the temperature varying spectra of VCSEL are agreed with the our simulated results presented in this paper. Also the temperature dependent model of DBR based on refractive index of graded multi-AlxGa1-xAs/ AlyGa1-yAs has been proposed. So, a series of optoelectronic measurements experimentally confirm our results again. The maximum reflectivity of the top and bottom DBRs are 96.4 and 99.98%, respectively. The central wavelengths of the bandwidth spectra in the top and bottom DBR are same. i.e., 840nm. These results can be obtained the criteria for the high performance VCSEL design. The far-field patterns of transverse electromagnetic fields confined in <15μm active-layer aperture of selectively oxidized VCSEL have been observed.
We present results concerning the influence of organometrallic vapro phase epitaxy (OMVPE) grwoth paramters under ultra low V/III ratio on the surface morphology and temperature-dependent photoluminescence. Due to Indium segregation inteh 2D InAs wetting layers and accumulation from multi-atomic step edge on (001) 2° off toward (111) n-type GaAs substrate, self-assembled InAs quatnum dot formation takes pace aroudn or above 2D InAs islands while ~ one monolayer of InAs is regularly grown on GaAs substrate. It is attributed that the desorbed Indium Recaptured and nucleated effect on edge along (110)-orientation of GaAs substrate.
Self-assembled quantum dot has been realized in different optical-electric material systems and different growth techniques using Stranski-Krastanow growth mode [1]. The optical properties of quantum dots are of physical interest due to the experimental investigation. The theoretical predictions of quantum dot device have been well verified [2]. In the article, we studied the temperature dependent electrical and optical properties [2,3] of quantum dot under normal incidence. From the measurement results, we found the three-dimensional confinement of QD structure and the inter- confined state [4-6].
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