Mr. Shinichi Ito Profile

Shinichi Ito

at Toshiba S&S Products Company

SPIE Involvement:

Author

Publications (22)

Proceedings Article | 23 March 2010 Paper

Challenges of EUVL resist process toward practical application

Shinichi Ito, Yukiko Kikuchi, Daisuke Kawamura, Eishi Shiobara, Keiichi Tanaka, Hitoshi Kosugi, Junichi Kitano, Takayuki Toshima

Proceedings Volume 7636, 76362V (2010) https://doi.org/10.1117/12.846260

KEYWORDS: Extreme ultraviolet lithography, Photoresist processing, Critical dimension metrology, Semiconducting wafers, Extreme ultraviolet, Surface plasmons, Photomasks, Lithography, Nanoimprint lithography, Line edge roughness

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Proceedings Article | 1 April 2009 Paper

Feasibility study of non-topcoat resist for 22nm node devices

Koutaro Sho, Hirokazu Kato, Katsutoshi Kobayashi, Kazunori Iida, Tomoya Ori, Daizo Muto, Tsukasa Azuma, Shinichi Ito, Tomoharu Fujiwara, Yuuki Ishii, Yukio Nishimura, Takanori Kawakami, Motoyuki Shima

Proceedings Volume 7273, 72733B (2009) https://doi.org/10.1117/12.812475

KEYWORDS: Polymers, Photoresist processing, Semiconducting wafers, Line width roughness, Thin film coatings, Lithography, Scanners, Chemical species, Defect inspection, Immersion lithography

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Proceedings Article | 1 April 2009 Paper

Feasibility studies of coating method for planarization process

Kentaro Matsunaga, Tomoya Oori, Hirokazu Kato, Eishi Shiobara, Makoto Muramatsu, Mitsuaki Iwashita, Takahiro Kitano, Yusuke Horiguchi, Tomoya Ohashi, Satoshi Takei, Shinichi Ito

Proceedings Volume 7273, 72734E (2009) https://doi.org/10.1117/12.813647

KEYWORDS: Ultraviolet radiation, Coating, Lithography, Materials processing, Atomic force microscopy, Critical dimension metrology, Semiconducting wafers, Photoresist processing, Polymers, Scanning transmission electron microscopy

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Proceedings Article | 15 April 2008 Paper

LWR reduction in low-k1 ArF-immersion lithography

Kentaro Matsunaga, Tomoya Oori, Hirokazu Kato, Daisuke Kawamura, Eishi Shiobara, Yuichiro Inatomi, Tetsu Kawasaki, Mitsuaki Iwashita, Shinichi Ito

Proceedings Volume 6923, 69231E (2008) https://doi.org/10.1117/12.771922

KEYWORDS: Photoresist processing, Line width roughness, Vacuum ultraviolet, Etching, Photomasks, Immersion lithography, Image processing, Lithography, Natural surfaces, Semiconducting wafers

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Proceedings Article | 31 March 2008 Paper

Immersion resist process for 32-nm node logic devices

Tatsuhiko Ema, Koutaro Sho, Hiroki Yonemitsu, Yuriko Seino, Hiroharu Fujise, Akiko Yamada, Shoji Mimotogi, Yosuke Kitamura, Satoshi Nagai, Kotaro Fujii, Takashi Fukushima, Toshiaki Komukai, Akiko Nomachi, Tsukasa Azuma, Shinichi Ito

Proceedings Volume 6923, 69230E (2008) https://doi.org/10.1117/12.771008

KEYWORDS: Photoresist processing, Logic devices, Reflectivity, Photomasks, System on a chip, Etching, Transparency, Materials processing, Immersion lithography

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Proceedings Article | 26 March 2008 Paper

Sub-45nm resist process using stacked-mask process

Yuriko Seino, Katsutoshi Kobayashi, Koutaro Sho, Hirokazu Kato, Seiro Miyoshi, Keisuke Kikutani, Junko Abe, Hisataka Hayashi, Tokuhisa Ohiwa, Yasunobu Oonishi, Shinichi Ito

Proceedings Volume 6923, 69232O (2008) https://doi.org/10.1117/12.771840

KEYWORDS: System on a chip, Etching, Reactive ion etching, Reflectivity, Hydrogen, Fluorine, Lithography, Photoresist processing, Silica, Scanning electron microscopy

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Proceedings Article | 2 April 2007 Paper

Defectivity reduction studies for ArF immersion lithography

Kentaro Matsunaga, Takehiro Kondoh, Hirokazu Kato, Yuuji Kobayashi, Kei Hayasaki, Shinichi Ito, Akira Yoshida, Satoru Shimura, Tetsu Kawasaki, Hideharu Kyoda

Proceedings Volume 6519, 65191T (2007) https://doi.org/10.1117/12.711331

KEYWORDS: Bridges, Semiconducting wafers, Immersion lithography, Lithography, Scanners, 193nm lithography, Structural health monitoring, Digital watermarking, Thin film coatings, Defect inspection

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Proceedings Article | 29 March 2006 Paper

Pattern defect study using cover material film in immersion lithography

Daisuke Kawamura, Tomoyuki Takeishi, Kentarou Matsunaga, Eishi Shiobara, Yasunobu Oonishi, Shinichi Ito

Proceedings Volume 6153, 61531Q (2006) https://doi.org/10.1117/12.655505

KEYWORDS: Semiconducting wafers, Coating, Immersion lithography, Particles, Inspection, Silicon, Wafer inspection, Wafer testing, Water, Digital watermarking

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Proceedings Article | 4 May 2005 Paper

Influence of the watermark in immersion lithography process

Daisuke Kawamura, Tomoyuki Takeishi, Koutarou Sho, Kentarou Matsunaga, Naofumi Shibata, Kaoru Ozawa, Satoru Shimura, Hideharu Kyoda, Tetsu Kawasaki, Seiki Ishida, Takayuki Toshima, Yasunobu Oonishi, Shinichi Ito

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.599314

KEYWORDS: Scanning electron microscopy, Semiconducting wafers, Digital watermarking, Immersion lithography, Silicon, Photoresist processing, Thin film coatings, Coating, Liquids, Water

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Proceedings Article | 4 May 2005 Paper

Effect of post development process for resist roughness

Koutarou Sho, Tsuyoshi Shibata, Eishi Shiobara, Shinichi Ito

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.599209

KEYWORDS: Line width roughness, Photoresist processing, Image processing, Critical dimension metrology, Ultraviolet radiation, Scanning electron microscopy, Reactive ion etching, Polymers, Lithography, Absorption

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Proceedings Article | 28 May 2004 Paper

A new process for accurate alignment using laser ablation technology

Hiroshi Ikegami, Kenji Kawano, Kazuhiko Ishigo, Tatsuhiko Higashiki, Nobuo Hayasaka, Naoto Yoshitaka, Hideaki Kashiwagi , Masayoshi Kobayashi, Yoichi Ogawa, Shinichi Ito

Proceedings Volume 5377, (2004) https://doi.org/10.1117/12.534907

KEYWORDS: Aluminum, Laser irradiation, Laser ablation, Optical alignment, Semiconducting wafers, Thin films, Plasma, Metals, Tin, Laser applications

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Proceedings Article | 17 June 2003 Paper

New frequency stabilization method of a semiconductor laser using the Faraday effect of the Rb absorption line

Shinichi Ito, Toshiya Nimonji, Akihiko Sawamura, Takashi Sato, Masashi Ohkawa, Takeo Maruyama

Proceedings Volume 4989, (2003) https://doi.org/10.1117/12.474809

KEYWORDS: Magnetism, Laser stabilization, Absorption, Semiconductor lasers, Modulation, Signal detection, Gadolinium, Amplifiers, Polarization, Rubidium

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Proceedings Article | 12 June 2003 Paper

Novel development technique using ozonated water

Kei Hayasaki, Riichiro Takahashi, Tomoyuki Takeishi, Shinichi Ito

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485068

KEYWORDS: Semiconducting wafers, Photoresist processing, Critical dimension metrology, Particles, Natural surfaces, Scanning electron microscopy, Defect inspection, Inspection, Optical testing, Process engineering

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Proceedings Article | 12 June 2003 Paper

Novel laser ablation patterning with organic thin film in running water

Shinichi Ito, Hiroshi Ikegami, Kenji Kawano, Tomoyuki Takeishi, Nobuo Hayasaka, Masayoshi Kobayashi, Tetsuya Hamamoto, Yoichi Ogawa, Naoto Yoshitaka, Shoichi Terada

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485045

KEYWORDS: Laser ablation, Particles, Photoresist processing, Optical lithography, Optical alignment, Video, Cameras, Thin films, Lithography, Natural surfaces

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Proceedings Article | 1 August 2002 Paper

Novel baking technology using halogen lamps for higher-precision photomask fabrication

Hideaki Sakurai, Masamitsu Itoh, Noboru Fujiwara, Satoshi Yasuda, T. Ishimura, Shigeru Wakayama, Shinichi Ito

Proceedings Volume 4754, (2002) https://doi.org/10.1117/12.476950

KEYWORDS: Lamps, Halogens, Temperature metrology, Photomasks, Chromium, Quartz, Calibration, Waveguides, Infrared radiation, Surface finishing

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In fabrication of next-generation photomask for devices under 100 nm, more precise control of critical dimension (CD) is required. Each process for the photomask fabrication must be developed corresponding to each requirement of CD accuracy. The same applies to post-exposure baking (PEB) and post-coat baking (PCB), and so more precise control of reaction amount in baking is required. Multiple zone-controlled type of hot plate to improve uniformity of temperature has been enthusiastically developed Generally, conventional hot plates don't directly control the temperature of resist film because its measurement means, for example, thermo-couples or resistance bulb are embedded near the surface of hot plate, and so cannot accurately control resist temperature. We think next-generation baking technology should involve direct measurement and control of the actual temperature of films. Furthermore, serious problems arose in that heat history in PEB was different in each pattern area, such as mask center or edge, and large overshooting of temperature was caused in photomask baking because heat capacity of quartz is very large and heat transfer speed of quartz is very slow. To solve this problem, it is necessary to control resist temperature directly by means of a quick response. It is difficult to satisfy this requirement with conventional bakers of the hot plate type or with such bakers to which a minor improvement has been made to achieve the quick response. To realize the quick response, the four following concepts are needed. (i) Quick response of heat source for resist film (ii) Direct measuring of temperature of resist film (iii) Shortening interval of feedback (iv) Improvement of repeatability ofmeasuring temperature We have studied a candidate next-generation baking technology for photomask fabrication, namely a novel baking system consisting of halogen lamps and non-contact type thermometers. We call this novel baking system "Lamp Heater System". In this paper, the heating performance is reported.

Proceedings Article | 24 August 2001 Paper

Dissolution performance of device pattern with low-impact development

Shinichi Ito, Kei Hayasaki, Hiroko Nakamura

Proceedings Volume 4345, (2001) https://doi.org/10.1117/12.436900

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Video, Cameras, Lithography, CCD cameras, Curtains, Photoresist processing, Process engineering, Manufacturing

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Proceedings Article | 27 April 1999 Paper

High-accuracy development monitoring technology

Shinichi Ito, Kei Hayasaki, Kenji Kawano, Koutaro Sho, Shoji Mimotogi, Fumio Komatsu, Katsuya Okumura

Proceedings Volume 3743, (1999) https://doi.org/10.1117/12.346907

KEYWORDS: Semiconducting wafers, Process control, Image processing, Critical dimension metrology, Process engineering, Control systems, Image analysis, Deep ultraviolet, CCD cameras, Microelectronics

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Proceedings Article | 24 July 1996 Paper

Subquarter-micron lithography with dual-trench-type alternating PSM

Hideki Kanai, Kenji Kawano, Satoshi Tanaka, Eishi Shiobara, Masami Aoki, Ikuo Yoneda, Shinichi Ito

Proceedings Volume 2793, (1996) https://doi.org/10.1117/12.245213

KEYWORDS: Photomasks, Picosecond phenomena, Error analysis, Lithography, Phase shift keying, Phase shifts, Etching, Quartz, Opacity, Modulation

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Proceedings Article | 3 July 1995 Paper

Lithographic performance of SiNx single-layer halftone mask

Kenji Kawano, Masafumi Asano, Satoshi Tanaka, Takayuki Iwamatsu, Hiroyuki Sato, Shinichi Ito

Proceedings Volume 2512, (1995) https://doi.org/10.1117/12.212784

KEYWORDS: Transmittance, Halftones, Deep ultraviolet, Photomasks, Lithography, Phase shifts, Mercury, Lamps, Quartz, Silicon

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Proceedings Article | 3 July 1995 Paper

Advanced mask fabrication system

Tadahiro Takigawa, Toru Tojo, Yoji Ogawa, Kiyomi Koyama, Akira Ono, Soichi Inoue, Shinichi Ito, Mineo Goto

Proceedings Volume 2512, (1995) https://doi.org/10.1117/12.212798

KEYWORDS: Photomasks, Data conversion, Mask making, Inspection, Critical dimension metrology, Optical lithography, Deep ultraviolet, Optical resolution, Optical proximity correction, Transmittance

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Proceedings Article | 17 May 1994 Paper

Optimization of optical properties for single-layer halftone masks

Shinichi Ito, Hiroaki Hazama, Takashi Kamo, Hideya Miyazaki, Hiroyuki Sato, Kenji Hayashi, Fumiaki Shigemitsu, Ichiro Mori

Proceedings Volume 2197, (1994) https://doi.org/10.1117/12.175486

KEYWORDS: Photomasks, Optical properties, Transmittance, Reflection, Phase shifts, Quartz, Halftones, Refractive index, Semiconductors, Silicon

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Proceedings Article | 1 June 1990 Paper

New KrF excimer laser process for improving novolac-type photoresist resolution

Akitoshi Kumagae, Kazuo Sato, Shinichi Ito, Takayuki Minamiyama, Makoto Nakase

Proceedings Volume 1262, (1990) https://doi.org/10.1117/12.20139

KEYWORDS: Photoresist processing, Photoresist materials, Laser processing, Excimer lasers, Reactive ion etching, FT-IR spectroscopy, Ultraviolet radiation, Absorbance, Silicon, Oxides

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Showing 5 of 22 publications

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