Prof. Sonia Maria M. García-Blanco Profile

Prof. Sonia Maria M. García-Blanco

Professor at Univ Twente

SPIE Involvement:

Symposium Chair | Conference Chair | Editor | Author

Publications (40)

Proceedings Article | 13 March 2024 Presentation

High gain erbium doped aluminium oxide waveguide amplifiers integrated with silicon nitride circuits in a multi-layer platform

Dawson Bonneville, Carlos Osornio-Martínez, Ivo Hegeman, Meindert Dijkstra, Sonia García-Blanco

Proceedings Volume PC12889, PC1288906 (2024) https://doi.org/10.1117/12.3004710

KEYWORDS: Waveguides, Aluminum oxide, Silicon nitride, Erbium, Wavelength division multiplexing, Sputter deposition, Silicon, Quantum photonics, Ions, Telecommunications

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Proceedings Article | 13 March 2024 Presentation

Sputter-deposited aluminium oxide as a waveguide platform for UV photonics

Dawson Bonneville, Ward A. P. Hendriks, Soheila Mardani, Nadia Chahir, Bjorn Jongebloed, Meindert Dijkstra, Sonia García-Blanco

Proceedings Volume PC12889, PC1288905 (2024) https://doi.org/10.1117/12.3004840

KEYWORDS: Ultraviolet radiation, Waveguides, Quantum photonics, Aluminum oxide, Integrated photonics, Atomic layer deposition, Visible radiation, Thin films, Electron beam lithography, Dry etching

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Proceedings Article | 7 April 2023 Presentation

First near-UV hybrid integrated laser in the Al2O3 platform

Cornelis Franken, Ward Hendriks, Meindert Dijkstra, Adriano do Nascimento, Lisa Winkler, Albert van Rees, Soheila Mardani, Ronald Dekker, Joost van Kerkhof, Peter van der Slot, Sonia García-Blanco, Klaus Boller

Proceedings Volume PC12424, PC124240A (2023) https://doi.org/10.1117/12.2657253

KEYWORDS: Ultraviolet radiation, Semiconductor lasers, Photonic integrated circuits, Waveguides, Wave propagation, Silicon, Laser applications, Visible radiation, Tunable lasers, Transparency

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Proceedings Article | 17 March 2023 Presentation + Paper

Low-loss photonic integrated circuits for UV applications

W. A. P. Hendriks, M. Dijkstra, S. Mardani, I. Hegeman, Sonia Garcia-Blanco

Proceedings Volume 12424, 1242402 (2023) https://doi.org/10.1117/12.2657143

KEYWORDS: Waveguides, Ultraviolet radiation, Photonic integrated circuits, Aluminum, Light wave propagation, Wave propagation, Atomic layer deposition, Aluminum oxide, Refractive index, Cladding

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Proceedings Article | 17 March 2023 Presentation + Paper

Low-loss sputter coated aluminum nitride waveguides

S. Mardani, W. A. P. Hendriks, M. Dijkstra, S. Garcia-Blanco

Proceedings Volume 12424, 1242403 (2023) https://doi.org/10.1117/12.2656323

KEYWORDS: Annealing, Aluminum nitride, Wave propagation, Waveguides, Photonic integrated circuits, Sputter deposition, Surface roughness, Thin films, Ultraviolet radiation, Silicon

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Proceedings Article | 30 May 2022 Presentation

On-chip photonics erbium-doped amplifiers: fabrication and characterization of Al2O3:Er3+ and development as a laser platform

Dawson Bonneville, Ward Hendriks, Carlos Osornio-Martínez, Sohelia Mardani, Kai Wang, Anne Dijkstra, Sonia García-Blanco

Proceedings Volume PC12142, PC121420J (2022) https://doi.org/10.1117/12.2624950

KEYWORDS: Optical amplifiers, Laser development, Photonics, Waveguides, Silicon, Integrated optics, Photonic integrated circuits, Optics manufacturing, Ions, Wavelength division multiplexing

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Proceedings Article | 5 March 2022 Presentation + Paper

Propagation loss measurements in sputter coated titanium oxide waveguides

A. Aguirre Fontenla, I. Hegeman, W. A. P. M. Hendriks, C. E. Osornio-Martínez, M. Dijkstra, S. M. García-Blanco

Proceedings Volume 12004, 1200403 (2022) https://doi.org/10.1117/12.2610616

KEYWORDS: Waveguides, Microrings, Resonators, Titanium, Oxides, Channel waveguides, Sputter deposition, Refractive index, Polarization

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Proceedings Article | 18 April 2021 Presentation

Monolithic active-passive photonic integration

Sonia García-Blanco, Ivo Hegeman, Jinfeng Mu, Carlijn M. van Emmerik, Carlos Osornio Martinez, Meindert Dijkstra

Proceedings Volume 11775, 117750A (2021) https://doi.org/10.1117/12.2589271

KEYWORDS: Integrated optics, Active optics, Tolerancing, Titanium dioxide, Photonic integrated circuits, Optical amplifiers, Integrated photonics, Integrated circuits, Integrated circuit design

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Proceedings Article | 5 March 2021 Presentation

Welcome and Introduction to SPIE Conference 11689

Sonia García-Blanco, Pavel Cheben

Proceedings Volume 11689, 1168903 (2021) https://doi.org/10.1117/12.2592150

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Proceedings Article | 5 March 2021 Presentation + Paper

Poly-crystalline low-loss aluminium oxide waveguides

W. A. P. M. Hendriks, M. Dijkstra, I. Hegeman, F. Segerink, E. Keim, M. Dikkers, S. García-Blanco

Proceedings Volume 11689, 116890Z (2021) https://doi.org/10.1117/12.2578141

KEYWORDS: Waveguides, Oxides, Aluminum, Erbium, Ions, Doping, Crystals, Wave propagation, Thin films, Transmission electron microscopy

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Proceedings Article | 25 February 2020 Paper

Low loss TiO2 channel waveguides

I. Hegeman, M. Dijkstra, S. García-Blanco

Proceedings Volume 11283, 112830C (2020) https://doi.org/10.1117/12.2543003

KEYWORDS: Etching, Waveguides, Electron beam lithography, Channel waveguides, Reactive ion etching, Cladding, Sputter deposition, Titanium dioxide

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Proceedings Article | 7 March 2019 Paper

Gain dynamics in a highly ytterbium-doped potassium double tungstate thin-film amplifier

Yean-Sheng Yong, Shanmugam Aravazhi, Sergio Vázquez-Córdova, Jennifer Herek, Sonia García-Blanco, Markus Pollnau

Proceedings Volume 10896, 108961G (2019) https://doi.org/10.1117/12.2514806

KEYWORDS: Ions, Ytterbium, Absorption, Optical amplifiers, Thermal effects, Luminescence, Waveguides, Crystals

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Proceedings Article | 4 March 2019 Presentation

On-chip amplifiers and lasers on the Al2O3 integrated photonics platform (Conference Presentation)

Sonia García-Blanco, Carlijn van Emmerik, Jinfeng Mu, Michiel de Goede, Meindert Dijkstra, Lantian Chang

Proceedings Volume 10923, 109230B (2019) https://doi.org/10.1117/12.2509962

KEYWORDS: Amplifiers, Integrated photonics, Ions, Quenching (fluorescence), Luminescence, Transparency, Mid-IR, Semiconducting wafers, Laser applications, Active remote sensing

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Proceedings Article | 23 February 2018 Presentation + Paper

A novel polishing stop for accurate integration of potassium yttrium double tungstate on a silicon dioxide

Carlijn van Emmerik, Simen Martinussen, Jinfeng Mu, Meindert Dijkstra, Roy Kooijman, Sonia García-Blanco

Proceedings Volume 10535, 105350U (2018) https://doi.org/10.1117/12.2289955

KEYWORDS: Polishing, Crystals, Adhesives, Surface finishing, Aluminum, Waveguides, Potassium, Ultraviolet radiation, Yttrium, Ions

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Proceedings Article | 23 February 2018 Presentation + Paper

High-contrast slab waveguide fabrication in KY(WO4)2 by swift heavy ion irradiation

R. Frentrop, V. Tormo-Márquez, J. Olivares, S. García-Blanco

Proceedings Volume 10535, 105350O (2018) https://doi.org/10.1117/12.2290045

KEYWORDS: Ions, Refractive index, Waveguides, Crystals, Annealing, Carbon, Color centers

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Proceedings Article | 23 February 2018 Presentation + Paper

High quality factor Al2O3 microring resonators for on-chip sensing applications

M. de Goede, M. Dijkstra, R. Obregón Núñez, E. Martínez, S. García-Blanco

Proceedings Volume 10535, 1053504 (2018) https://doi.org/10.1117/12.2290004

KEYWORDS: Sensors, Microrings, Resonators, Refractive index, Aluminum, Waveguides, Water, Cladding, Proteins, Polarization

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Proceedings Article | 23 February 2018 Presentation + Paper

Pedestal disk resonator in potassium yttrium double tungstate

Simen Martinussen, Raimond Frentrop, Meindert Dijkstra, Frans Segerink, Victoria Tormo-Márquez, José Olivares, Sonia García-Blanco

Proceedings Volume 10535, 105350Q (2018) https://doi.org/10.1117/12.2289887

KEYWORDS: Refractive index, Crystals, Etching, Wet etching, Waveguides, Potassium, Resonators, Ytterbium, Annealing, Ion implantation

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Proceedings Article | 21 November 2017 Open Access

Radiometric packaging of uncooled bolometric infrared focal plane arrays

Sonia García-Blanco, Timothy Pope, Patrice Côté, Mélanie Leclerc, Linh Ngo Phong, François Châteauneuf

Proceedings Volume 10566, 105662V (2017) https://doi.org/10.1117/12.2308275

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Proceedings Article | 16 February 2017 Presentation + Paper

Ultra-low-loss and broadband mode converters in Si3N4 technology

Jinfeng Mu, Meindert Dijkstra, Michiel de Goede, Yean-Sheng Yong, Sonia García-Blanco

Proceedings Volume 10106, 101060R (2017) https://doi.org/10.1117/12.2252706

KEYWORDS: Silicon, Waveguides, Low pressure chemical vapor deposition, Integrated photonics, Wave propagation, Transparency, Polymer multimode waveguides, Polymers, Photonics, Aluminum, Etching, Ultraviolet radiation, Tolerancing

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Proceedings Article | 16 February 2017 Presentation + Paper

Spectroscopy of erbium-doped potassium double tungstate waveguides

Sergio Vázquez-Córdova, Shanmugam Aravazhi, Christos Grivas, Alexander Heuer, Christian Kränkel, Yean-Sheng Yong, Sonia García-Blanco, Jennifer Herek, Markus Pollnau

Proceedings Volume 10106, 1010604 (2017) https://doi.org/10.1117/12.2252488

KEYWORDS: Erbium, Waveguides, Optical amplifiers, Instrument modeling, Energy transfer, Optical pumping, Crystals, Signal detection, Luminescence, Amplifiers, Spectroscopy, Lutetium

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Proceedings Article | 16 February 2017 Paper

Temperature-dependent absorption and gain of ytterbium-doped potassium double tungstates for chip-scale amplifiers and lasers

Yean-Sheng Yong, Shanmugam Aravazhi, Sergio Vázquez-Córdova, Jennifer Herek, Sonia García-Blanco, Markus Pollnau

Proceedings Volume 10106, 1010606 (2017) https://doi.org/10.1117/12.2252154

KEYWORDS: Spectroscopy, Absorption, Optical amplifiers, Ytterbium, Waveguide lasers, Waveguides, Thin films, Temperature metrology, Gadolinium

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Proceedings Article | 1 March 2016 Paper

Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding

Jinfeng Mu, Mustafa Sefunc, Bojian Xu, Meindert Dijkstra, Sonia García-Blanco

Proceedings Volume 9750, 975012 (2016) https://doi.org/10.1117/12.2212206

KEYWORDS: Waveguides, Optical amplifiers, Optical interconnects, Silicon, Laser applications, Sensors, Erbium, Erbium lasers, Polymers, Polymer multimode waveguides, Ions, Potassium, Refractive index, Silica, Wave propagation, Ultraviolet radiation

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Proceedings Article | 27 February 2015 Paper

Spiral amplifiers in a-Al2O3:Er on a silicon chip with 20 dB internal net gain

S. Vázquez-Córdova, E. Bernhardi, Ke. Wörhoff, J. Herek, S. García-Blanco, M. Pollnau

Proceedings Volume 9365, 93650M (2015) https://doi.org/10.1117/12.2077503

KEYWORDS: Waveguides, Ions, Doping, Amplifiers, Silicon, Erbium, Neodymium, Optical amplifiers, Wavelength division multiplexing, Semiconducting wafers

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Proceedings Article | 27 February 2015 Paper

High index contrast potassium double tungstate waveguides towards efficient rare-earth ion amplification on-chip

Mustafa Akin Sefunc, Frans Segerink, Sonia Garcia-Blanco

Proceedings Volume 9365, 93650P (2015) https://doi.org/10.1117/12.2077086

KEYWORDS: Waveguides, Ions, Silica, Polishing, Optical amplifiers, Fabry–Perot interferometers, Adhesives, Potassium, Refractive index, Crystals

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Proceedings Article | 27 February 2015 Paper

Low-loss sharp bends in low contrast polymer hybrid metallic waveguides

M. Sefunc, W. van de Meent, A. Coenen, Antonio Pace, M. Dijkstra, S. García-Blanco

Proceedings Volume 9365, 93650V (2015) https://doi.org/10.1117/12.2083856

KEYWORDS: Waveguides, Metals, Polymers, Dielectrics, Polymer multimode waveguides, Gold, Refractive index, Silica, Wave propagation, Semiconducting wafers

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Proceedings Article | 20 February 2015 Paper

On the efficiency of Tm-doped 2µm lasers

K. van Dalfsen, S. Aravazhi, C. Grivas, S. García-Blanco, M. Pollnau

Proceedings Volume 9342, 93421U (2015) https://doi.org/10.1117/12.2077490

KEYWORDS: Quantum efficiency, Channel waveguides, Chromium, Potassium, Ions, Waveguides, Thulium, Neodymium, Epitaxy, Polishing

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Proceedings Article | 1 May 2014 Paper

Erbium-doped spiral amplifiers with 20 dB gain on a silicon chip

S. Vázquez-Córdova, E. Bernhardi, K. Wörhoff, S. García-Blanco, M. Pollnau

Proceedings Volume 9133, 913308 (2014) https://doi.org/10.1117/12.2052298

KEYWORDS: Waveguides, Optical amplifiers, Erbium, Silicon, Channel waveguides, Wave propagation, Light wave propagation, Absorption, Amplifiers, Semiconductor lasers

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SPIE Journal Paper | 29 June 2012 Open Access

Special Section Guest Editorial: Reliability, Packaging, Testing, and Characterization of MOEMS and MEMS III

Sonia García-Blanco, Rajeshuni Ramesham

JM3, Vol. 11, Issue 02, 021201, (June 2012) https://doi.org/10.1117/12.10.1117/1.JMM.11.2.021201

KEYWORDS: Reliability, Packaging, Microopto electromechanical systems, Microelectromechanical systems, Nanostructures, Nanofabrication

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Proceedings Article | 14 February 2011 Paper

Large diameter dual-axis MEMS-based mirror for laser beam steering

S. Ilias, F. Picard, K. Le Foulgoc, J. Osouf, C. Larouche, J-S. Caron, P. Topart, S. Garcia Blanco, D. Vincent, J. F. Lepage, B. Gilbert

Proceedings Volume 7930, 79300Q (2011) https://doi.org/10.1117/12.876212

KEYWORDS: Mirrors, Silicon, Electrodes, Semiconducting wafers, Gold, Electroplating, Etching, Nickel, Photoresist materials, Micromirrors

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Proceedings Article | 17 January 2011 Paper

Nd-doped waveguide amplifiers for heterogeneous integration in optical backplanes

Feridun Ay, Jing Yang, Tobias Lamprecht, Kerstin Wörhoff, Sonia García-Blanco, Alfred Driessen, Folkert Horst, Bert Offrein, Markus Pollnau

Proceedings Volume 7942, 79420Q (2011) https://doi.org/10.1117/12.873981

KEYWORDS: Waveguides, Polymers, Optical amplifiers, Channel waveguides, Polymer multimode waveguides, Integrated optics, Ions, Channel projecting optics, Signal attenuation, Wave propagation

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SPIE Journal Paper | 1 November 2010

Pressure sensing in vacuum hermetic micropackaging for MOEMS-MEMS

Marco Sisto, Sonia García-Blanco, Loic Le Noc, Bruno Tremblay, Yan Desroches, Jean-Sol Caron, Francis Provencal, Francis Picard

JM3, Vol. 9, Issue 04, 041109, (November 2010) https://doi.org/10.1117/12.10.1117/1.3506744

KEYWORDS: Microsensors, Temperature metrology, Sensors, Calibration, Indium oxide, Bolometers, Infrared bolometers, Resistance, Infrared sensors, Environmental sensing

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SPIE Journal Paper | 1 November 2010

Design, manufacturing, and qualification of an uncooled microbolometer focal plane array-based radiometric package for space applications

Sonia García-Blanco, Patrice Côté, Melanie Leclerc, Nathalie Blanchard, Yan Desroches, Jean-Sol Caron, Linh Ngo Phong, François Châteauneuf, Timothy Pope

JM3, Vol. 9, Issue 04, 041105, (November 2010) https://doi.org/10.1117/12.10.1117/1.3492413

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Proceedings Article | 23 September 2010 Paper

MEMS/MOEMS foundry services at INO

Sonia García-Blanco, Samir Ilias, Fraser Williamson, Francis Généreux, Loïc Le Noc, Michel Poirier, Christian Proulx, Bruno Tremblay, Francis Provençal, Yan Desroches, Jean-Sol Caron, Carl Larouche, Patrick Beaupré, Benoit Fortin, Patrice Topart, Francis Picard, Christine Alain, Timothy Pope, Hubert Jerominek

Proceedings Volume 7750, 77500R (2010) https://doi.org/10.1117/12.873078

KEYWORDS: Indium oxide, Microelectromechanical systems, Microfabrication, Gold, Micromirrors, Sensors, Semiconducting wafers, Manufacturing, Photomicroscopy, Actuators

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In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from 20 to 35 μm and a density of 0.3% the bulk density of gold. Two Balzers thin-film deposition instruments (BAP-800 and BAK-760) permit INO to offer optical thin film manufacturing. Recent work in this field includes the design and development of a custom filter for the James Webb Space Telescope (JWST) as collaboration with the Canadian company ComDEV. An overview of the different microfabrication foundry services offered by INO will be presented together with the most recent achievements in the field of MEMS/MOEMS.

Proceedings Article | 5 February 2010 Paper

Pressure sensing in vacuum hermetic micropackaging for MOEMS-MEMS

Marco Michele Sisto, Sonia García-Blanco, Loïc Le Noc, Bruno Tremblay, Yan Desroches, Jean-Sol Caron, Francis Provencal, Francis Picard

Proceedings Volume 7592, 759204 (2010) https://doi.org/10.1117/12.840931

KEYWORDS: Microsensors, Temperature metrology, Indium oxide, Sensors, Bolometers, Calibration, Infrared bolometers, Resistance, Infrared sensors, Microbolometers

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Proceedings Article | 2 September 2009 Paper

The EarthCARE broadband radiometer detectors

Christian Proulx, Fraser Williamson, Martin Allard, Georges Baldenberger, David Gay, Sonia Garcia-Blanco, Patrice Côté, Louis Martin, Carl Larouche, Samir Ilias, Tim Pope, Martin Caldwell, Kim Ward, John Delderfield

Proceedings Volume 7453, 74530S (2009) https://doi.org/10.1117/12.829935

KEYWORDS: Sensors, Staring arrays, Indium oxide, Readout integrated circuits, Gold, Prototyping, Reflectivity, Radiometry, Electronics, Simulation of CCA and DLA aggregates

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Proceedings Article | 7 May 2009 Paper

Space qualification of a 512x3 pixel uncooled microbolometer FPA

Timothy Pope, Fabien Dupont, Sonia Garcia Blanco, Fraser Williamson, Claude Chevalier, Linda Marchese, Francois Chateauneuf, Hubert Jerominek, Ngo-Phong Linh, Robert Bouchard

Proceedings Volume 7298, 729826 (2009) https://doi.org/10.1117/12.819922

KEYWORDS: Staring arrays, Sensors, Temperature metrology, Long wavelength infrared, Microbolometers, Cameras, Mid-IR, Radio optics, Stray light, Black bodies

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Proceedings Article | 10 February 2009 Paper

Radiometric packaging of uncooled microbolometer FPA arrays for space applications

S. García-Blanco, P. Cote, M. Leclerc, N. Blanchard, Y. Desroches, J.-S. Caron, L. Ngo Phong, F. Chateauneuf, T. Pope

Proceedings Volume 7206, 720604 (2009) https://doi.org/10.1117/12.810025

KEYWORDS: Sensors, Copper, Temperature metrology, Aluminum, Stray light, Staring arrays, Indium oxide, Microbolometers, Radiation effects, Long wavelength infrared

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INO has extensive experience in the design and fabrication of focal plane arrays (FPAs) of uncooled microbolometers. In particular, the FPA of 512×3 microbolometers, developed in collaboration with the Canadian Space Agency (CSA), has been selected for use in the NIRST (New Infrared Sensor Technology) radiometer of the SAC-D Aquarius mission. The FPA has been designed for pushbroom scanning of the Earth to provide radiometric data in the mid- and long-wave infrared for the monitoring of fires as well as thermal mapping of ocean temperature. Uncooled microbolometer detectors are suited for space applications due to their low power consumption while still exhibiting adequate performance. Furthermore, the spectral range of their response could be tuned from the mid- to the far-infrared to meet different mission requirements. In order to ensure that the detector receives only the thermal contribution from the desired target and to minimize radiometric error due to variation of the temperature of the surrounding during the measurements, a radiometric package is required. In a radiometric package the detector environment is thermally stabilized by means of a temperature controlled radiation shield. The radiation shield should also be designed to prevent stray radiation from reaching the detector. Under the Space Technology Development Program of the CSA, INO has designed, assembled and tested a radiometric package in order to characterize its performance and compatibility with the space environment. The operating spectral band is defined by the spectral characteristics of a bandpass filter placed in front of the FPA. For typical space missions, the package must pass standard environmental tests without degradation of its performance (thermal cycling from -55 to +85 °C according to MIL-STD-810, random acceleration up to 14 G RMS from 20-2000 Hz and shock up to 75 G). In order to ensure reliability in those conditions while maintaining optimum performance, an adequate selection of materials is necessary. In this paper, INO's radiometric packaging technology for uncooled microbolometer FPA's will be presented. The selection of materials will be discussed and the final choices presented based on thermal simulations and experimental data. The effects of different design parameters on the performance, such as material, shape and thickness of radiation shield and choice of adhesive have been studied. An instantaneous noise equivalent temperature difference (NETD) of ~ 20 mK was obtained under the measurement conditions (broadband LWIR, 140 ms integration time, f/1 optics, characterization in flood exposure). The design of the package reduced the contribution of environmental temperature variations on the offset of the sensor. The equivalent response of the package varied less than 0.08 °C per degree of variation of the temperature of the package. The package also showed low sensitivity to stray radiation as a result of the effectiveness of the radiation shield design. The device successfully passed the prescribed environmental tests without degradation of performance.

Proceedings Article | 9 February 2009 Paper

Hybrid wafer-level vacuum hermetic micropackaging technology for MOEMS-MEMS

Sonia Garcia-Blanco, Patrice Topart, Karine Le Foulgoc, Jean-Sol Caron, Yan Desroches, Christine Alain, Francois Chateauneuf, Hubert Jerominek

Proceedings Volume 7206, 720602 (2009) https://doi.org/10.1117/12.810028

KEYWORDS: Packaging, Gases, Indium oxide, Optical microcavities, Microelectromechanical systems, Carbon dioxide, Argon, Microbolometers, Temperature metrology, Diffusion

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Packaging constitutes one of the most costly steps of MEMS/MOEMS manufacturing. The package protects the MEMS devices and, in the case of MOEMS, it also provides light access to the device. In many cases, MEMS require a specific atmosphere for their proper functioning. The atmosphere should be kept invariable during the lifetime of the package in order to not degrade the performance of the device. Maintaining a constant atmosphere inside the package becomes more challenging as the cavity volume is decreased to the microliter and nanoliter range. Other packaging requirements are compatibility with wafer-level microfabrication techniques (cost reduction) and low temperature assembly in cases where temperature sensitive devices are to be packaged. In recent years, INO has performed a great amount of work towards the development of uncooled IR microbolometer detectors using VOx technology. Different pixel designs have been optimized for different applications. The bolometer pixels require a vacuum atmosphere below 10 mTorr to be maintained during the lifetime of the device in order to operate at their highest sensitivity. INO's micropackaging technology has been demonstrated to provide base pressures below 5 mTorr. An equivalent flow rate of 2.5×10^-14 Torr.l/sec has been obtained for a device packaged without any getter. The advantages of INO's micropackaging technology are the possibility of achieving very low base pressures, the low temperatures required for the assembly (the package device is never exposed to a temperature above 150 °C) and its compatibility with hybrid wafer-level packaging. The technology has been developed for the micropackaging of INO's 160×120 pixel uncooled microbolometer FPA, but it is compatible with any other kinds of MOEMS-MEMS devices requiring vacuum hermetic packaging. In order to increase the lifetime of the package, knowledge of the gases outgassing inside the package is crucial. A hybrid approach has been chosen as it permits packaging only known-good dies and saving considerable quantities of IR window material. In INO's hybrid wafer-level packaging, dicing is performed only through one of the wafers, therefore reducing the risk of perturbing the vacuum during the separation of the different dies.

Proceedings Article | 18 February 2008 Paper

Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs

S. Garcia-Blanco, P. Topart, Y. Desroches, J.S. Caron, F. Williamson, C. Alain, H. Jerominek

Proceedings Volume 6884, 68840P (2008) https://doi.org/10.1117/12.761324

KEYWORDS: Ceramics, Microelectromechanical systems, Microbolometers, Indium oxide, Packaging, Resistance, Staring arrays, Semiconducting wafers, Readout integrated circuits, Optical microcavities

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Micro-Electro-Mechanical Systems (MEMS) packaging constitutes most of the cost of such devices. For the integration of MEMS with microelectronics systems to be widespread, a drastic reduction of the overall price is required. Wafer-level-packaging allows a fundamental reduction of the packaging cost by combining wafer-level microfabrication techniques with wafer-to-wafer bonding. To achieve the vacuum atmosphere required for the operation of many MEMS devices, bonding techniques such as anodic bonding, eutectic bonding, fusion bonding and gold to gold thermocompression bonding have been utilized, which require relatively high temperatures (>300°C) being in some cases incompatible with MEMS and microelectronics devices. Furthermore, to maintain vacuum integrity over long periods of time, getters requiring high activation temperatures are usually employed. INO has developed a hybrid wafer-level micropackaging technology based on low temperature fluxless solder joints in which the micropackaged MEMS device is not exposed to a temperature over 150°C. The micropackages have been designed for 160×120 microbolometer FPAs. Ceramic spacers are patterned by standard microfabrication techniques followed by laser micromachining. AR-coated floatzone silicon IR windows are patterned with a solderable layer. Both, microbolometer dies and windows are soldered to the ceramic tray by a combination of solder paste stencil printing, reflow and fluxless flip-chip bonding. A low temperature getter is also introduced to control outgassing of moisture and CO₂ during the lifetime of the package. Vacuum sealing is carried out by locally heating the vacuum port after bake out of the micropackages. In this paper, the vacuum integrity of micropackaged FPA dies will be reported. Base pressures as low as 5 mTorr and equivalent flow rates at room temperature of 4×10^-14 Torr.l/s without getter incorporation have been demonstrated using integrated micro-pressure gauges. A study of the influence of different packaging parameters on the lifetime of micropackages will be presented.

Proceedings Article | 8 February 2008 Paper

3D MOEMS-based optical micro-bench platform for the miniaturization of sensing devices

Sonia Garcia-Blanco, Jean-Sol Caron, Sébastien Leclair, Patrice Topart, Hubert Jerominek

Proceedings Volume 6887, 68870F (2008) https://doi.org/10.1117/12.761339

KEYWORDS: Microlens, Nickel, Optical alignment, Semiconducting wafers, Electroplating, Sol-gels, Microfabrication, Integrated optics, Optical filters, Multimode fibers

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Showing 5 of 40 publications

Proceedings Volume Editor (12)

SPIE Conference Volume | 5 April 2024

Integrated Optics: Devices, Materials, and Technologies XXVIII

SPIE Conference Volume | 26 April 2023

Integrated Optics: Devices, Materials, and Technologies XXVII

SPIE Conference Volume | 8 April 2022

Integrated Optics: Devices, Materials, and Technologies XXVI

SPIE Conference Volume | 14 April 2021

Integrated Optics: Devices, Materials, and Technologies XXV

SPIE Conference Volume | 27 March 2020

Integrated Optics: Devices, Materials, and Technologies XXIV

Showing 5 of 12 publications

Conference Committee Involvement (29)

Integrated Optics: Devices, Materials, and Technologies XXIV

25 January 2025 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XXVIII

29 January 2024 | San Francisco, California, United States

SPIE OPTO

27 January 2024 | San Francisco, United States

Integrated Optics: Devices, Materials, and Technologies XXVII

30 January 2023 | San Francisco, California, United States

SPIE OPTO

28 January 2023 | San Francisco, United States

Integrated Optics: Devices, Materials, and Technologies XXVI

24 January 2022 | San Francisco, California, United States

SPIE OPTO

22 January 2022 | San Francisco, United States

Integrated Optics: Devices, Materials, and Technologies XXV

6 March 2021 | Online Only, California, United States

SPIE OPTO

6 March 2021 | Online Only, United States

Integrated Optics: Devices, Materials, and Technologies XXIV

3 February 2020 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XXIII

4 February 2019 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XXII

29 January 2018 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XXI

30 January 2017 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XX

15 February 2016 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XIX

9 February 2015 | San Francisco, California, United States

MOEMS and Miniaturized Systems XIII

3 February 2014 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII

3 February 2014 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XVIII

3 February 2014 | San Francisco, California, United States

Integrated Optics: Devices, Materials, and Technologies XVII

5 February 2013 | San Francisco, California, United States

MOEMS and Miniaturized Systems XII

4 February 2013 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII

4 February 2013 | San Francisco, California, United States

MOEMS and Miniaturized Systems XI

24 January 2012 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI

23 January 2012 | San Francisco, California, United States

MOEMS and Miniaturized Systems X

24 January 2011 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X

24 January 2011 | San Francisco, California, United States

MOEMS and Miniaturized Systems IX

25 January 2010 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX

25 January 2010 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII

28 January 2009 | San Jose, California, United States

MOEMS and Miniaturized Systems VIII

27 January 2009 | San Jose, California, United States

Showing 5 of 29 Conference Committees

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