Juniper’s silicon photonics technology employs an entirely new approach to optics manufacturing that leverages design, wafer manufacturing, packaging and test infrastructure and methodologies from the microelectronics ecosystem, resulting in a fabless optical transceiver manufacturing flow cable of scaling, in both cost and performance, with the needs of the networking industry. Juniper’s fully integrated “Opto-ASIC” transceiver leverages densely packaged electronic and photonic die in a single, low-cost package that supports common module form factors as well as on-board and on-package optics applications. The ability to incorporate all optical components, including lasers, within a single, common silicon die is a key enabler of the approach, fundamentally changing and simplifying how an optical transceiver can be assembled and tested. We will review lessons learned and provide a preview of the road ahead.
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