A thin-disk multipass amplifier in an industrial package provides pulse energy and power scaling up to an average power in the kW regime with 10 mJ compressed pulses or 40 mJ CPA free pulses. The flexibility of the slab (TRUMPF TruMicro 6000 based) seed laser, such as choice of repetition rate, pulse duration, bursts or pulse on demand is maintained. Due to its mechanical and thermal stability, different applications like surface structuring or generation of EUV or X-ray radiation can be addressed.
We demonstrate ultrafast high-power laser operation, both at multi-kW average power in ultrashort-pulsed operation over extended bursts with hundreds of MHz intra-burst repetition rate from a modified TruMicro 6020 industrial laser, as well as uninterrupted, quasi-CW operation at an average power beyond 1 kW obtained with a TEM00 multipass thin-disk laser booster amplifier. The pulse repetition rate can be varied from 50 MHz to beyond 1 GHz, with single-pulse energies well above 10 μJ and single-pulse peak powers far beyond 10 MW without a post-compressor. These systems are attractive, e.g., for high-throughput materials processing or for driving nonlinear processes.
In this contribution we focus on micro-machining of several materials in different processing regimes. The temporal energy deposition is influenced during operation on a femto- up to a microsecond timescale. Using an off-axis microscope, we present camera image sequences automatically obtained during the ablation process, capturing the surface changes during machining, and revealing spatially and temporally resolved developments. This aids in further process understanding such as parameter dependencies and critical process regimes (formation of unwanted surface morphologies). To optimize both productivity and quality, combined processes with successive parameter sequences are demonstrated, enabled by fast and controlled intra-process pulse parameter switching.
The thin-disk multipass amplifier provides pulse energy and power scaling up to more than 100 mJ of pulse energy and average power in the kW regime with a system amplification factor in the range of 100. The flexibility of the seed laser, such as choice of repetition rate, pulse duration, bursts or pulse on demand is maintained. Due to its mechanical and thermal stability, different applications like glass cutting or high harmonic generation for EUV or X-ray radiation can be addressed even in a harsh industrial environment.
Within the last decade, ultrafast laser micromachining has found broad applications in a variety of scientific and industrial fields. Likewise, green technologies like E-mobility, photovoltaics or wind power plants have become essential in helping to protect our environment within the last years. Such advancements as well as improvements concerning other electronic devices are profiting from a continuous progress in semiconductor development. Hereby, among other wide-gap semiconductors, SiC is a key material for the production of many high power electronic devices due to its beneficial material properties. Compared to Si-based devices, electronic elements based on SiC enable higher voltages or an increase of general device efficiency. Since well-established production technologies for Si are often not directly transferrable to the machining of SiC, efficient and productive laser-based micromachining calls for extensive parameter studies prior to volume production. In this contribution, we show a comparison of ultra-short pulsed Si- and SiC-machining, as well as different benefits of highly flexible laser systems like the TruMicro series 2000. Choosing an optimized temporal energy deposition on a short- to ultra-short timescale can address a variety of machining aspects like ablation efficiency and surface quality. Using the unique features of the TruMicro series 2000, the temporal energy deposition can be influenced during operation on a femto- up to a microsecond timescale by tuning parameters such as the ultrashort pulse duration or employing bursts in the MHz- and GHz-regime. This enhanced flexibility leads to comprehensive and automated parameter studies that allow for next-generation process understanding.
Ultrashort pulse micromachining has found a rising number of applications in a variety of scientific and industrial fields. In order to address the growing field of applications, target materials and customer requirements, a high degree of pulse parameter flexibility and ease of integration is needed. The newest generation of the TruMicro Series 2000 delivers unique features such as fast tunable pulse duration, MHz- up to GHz-burst modes in combination with flexible Pulse on Demand and elevated average power of 100W for improved productivity scaling. Three available wavelengths (343nm, 515nm, 1030nm), an integrated hollow-core fiber interface, as well as a new advanced ultrashort pulse laser control, all combined into a new one box optomechanical design with identical interfaces and dimensions opens new paths for cutting-edge applications. The improved flexibility enables fast (<800ms) and controlled (without affecting beam pointing or energy stability) tuning of pulse parameters such as pulse duration, pulse energy, pulse frequency, QCW-mode and pulse spacing up to GHz-bursts (patent pending technology). Inter- as well as intra-process parameter switching offers advanced successive parameter sequences for tailored machining. Combined processes are demonstrated that optimize both productivity (ablation rate) and quality (surface roughness, color, gloss etc.) for ablation of various metals, semiconductors and ceramics by choosing suitable timescales for energy deposition. Automated parameter studies are shown to quickly generate quantitative surface quality characteristics and foster in-depth process understanding depending on pulse parameters. Furthermore, the latest benefits for ultrafast processing employing position synchronized output and the integrated hollow-core fiber delivery with TruMicro Series 2000 are demonstrated.
Ultrashort laser pulses in the deep ultraviolet (DUV) based on nonlinear-optical conversion of NIR solid state sources promise advantages for the machining of wide-bandgap materials such as compound semiconductors like indium / aluminum / gallium nitride (InAlGaN, AlN, GaN), silicon carbide (SiC), zinc sulfide (ZnS), or boron nitride (BN). We present systems providing few-picosecond pulses at 257.5 nm with high average power exceeding 20 W of DUV obtained by frequency quadrupling of our proven TruMicro Series of industrial ultrafast amplifiers. High beam quality and decent lifetime of the DUV optics are demonstrated.
Industrial ultrafast lasers such as TRUMPF’s TruMicro Series are indispensable tools in many precision machining processes. Large 24/7 applications range from machining of sapphire or glass to ceramics, polymers, and metals in industries from the automotive sector to consumer electronics. In typical installations such pico- and femtosecond lasers currently operate at average power levels up to 150 W, often with nonlinear frequency conversion to the visible or UV. Based on the advanced amplifier technology pioneered by AMPHOS we introduce our new hybrid fiber–InnoSlab amplifier generation TruMicro Series 6000, capable of producing the highest average power at utmost flexibility and reliability.
Ultrafast micromachining has found broad applications in a variety of scientific and industrial fields. Different materials and competing customer requirements (surface quality vs. processing speed vs. surface structure etc.) call for parameter studies prior to volume production as well as pulse parameter flexibility during operation. Up to now, often a nonoptimized point of operation for either best speed or quality had to be chosen due to limited laser source flexibility. TruMicro Series 2000 introduces true inter- and intra-process flexibility for pulse parameters such as pulse duration, pulse energy and pulse spacing up to GHz bursts. As of now, switching the pulse duration is possible within 300 fs and 20 ps in less than 600 ms without affecting beam pointing or energy stability. Therefore, intra-process pulse parameter changes allow maximization of the ablation-volume efficiency in one step and surface-quality optimization in a second, finalizing step. Additionally, inter-process pulse parameter changes enable material changes in between workpieces. In this contribution, we show how this novel flexibility for the first time leads to comprehensive and automated parameter studies that allow for next-generation process understanding and the clear selection of enhanced points of operation. We demonstrate how ablation of various materials can be increased by employing bursts on a nanosecond timescale where a simple increase in fluence would result in cone-like protrusions. Choosing the suitable timescale for energy deposition can either maximize energy efficiency of ablation or optimize ablation quality. With the TruMicro Series 2000, both optima can be combined to one efficient, high-quality process.
We report on TRUMPF´s industrialized hollow-core-fiber laser-light-cable coupled to the TruMicro ultrafast laser platform. A flexible connection between processing head and laser source offers new opportunities in the design of compact laser processing machines. The compact, light-weight connector at the end of the delivery fiber provides a well defined optical interface close to the processing optics, and spatially eases integration of any laser to the machine, enabling optimum access for fast system maintenance without any need for re-alignments. Constant optical beam parameters are ensured even during dynamical movement of the laser-light-cable and the processing head. TRUMPF offers a complete in-house solution consisting of the ultrafast laser platform with up to 10 m long hollow-core-fiber laser-light-cables. The system further includes monitoring devices, e.g. for mode field and power, fiber protection and a safety circuit.
As an application example of this compact laser system we present further progress on glass welding. Ultrashort laser pulses enable local bulk modifications in glass as well as controlled melting via heat accumulation. Improved glass welding using optimized energy modulation of successive laser pulses from our advanced TruMicro Series 2000 platform are discussed. The approach for joining brittle materials provides long-term stable and gas-tight joints.
Within the last ten years, ultrashort pulsed lasers have developed from complex scientific devices to reliable industrial tools for various applications. MOPA systems with fiber amplifiers offer an excellent combination of small size, reliable design and flexible parameters. However, their power and more specifically pulse energy levels could not reach the high level of other laser designs based on disk or rod amplifiers.
In the latest development generation of TRUMPF’s TruMicro 2000 series, we present an all-fiber ultrashort pulse laser with a maximum pulse energy of 100 µJ based on industrial grade technologies. The high energy level allows for efficient frequency conversion to a wavelength of 515 nm which is beneficial for numerous applications.
Furthermore, the linear amplifier concept combined with intelligent electronics and software allow for flexible adaption of parameters: The laser is equipped with a sophisticated pulse-on-demand function that allows variable pulse picking from the seed frequency of 50 MHz. This bears the challenge of fluctuating pulse ensures which is overcome by a combination of measures that ensure constant pulse energies even with variable pulse distances. As a result, the laser pulses can be synchronized to external trigger signals with a time jitter as low as 30 ns.
Additionally, the TruMicro 2000 offers a flexible burst mode up to 8 pulses in one burst and the pulse duration can be changed continuously from femto- to picoseconds. With a newly patented technology, the full sweep from 300 fs to 20 ps is done in less than 500 ms without any influence on beam parameters.
The world market for laser micro-processing has seen a tremendous increase within the last 24 months triggered predominantly by large scale projects in the electronics industry. By far the largest contribution to this growth came from UV nano- and picosecond lasers for various applications for manufacturing consumer electronics devices.
The process chain of flexible OLED display used in smart devices (phones, watches, tablets) is heavily relying on ultraviolet lasers: Debonding of the large display foils (typically 1500 x 1850 mm²) from the carrier glass they are produced on is a critical process since it is one of the last steps in the process chain at the peak of the added value. UV nanosecond lasers enable reliable debonding (laser lift-off) without risking any damage to the displays.
Subsequently, the display cells are singulated by laser cutting. Also this process step relies heavily on UV lasers, but in this case with ultrashort pulses. The combination of ultrashort pulse duration and short wavelength allows efficient and precise cutting of these multi-layer materials without unwanted heat affected zones or even thermal damage to the electronics in the display. Various additional parts that are integrated in smart devices like polarizer foils and flexible printed circuit boards are based on multi-material foils and are cut to their net shape with UV nanosecond or ultrashort pulsed lasers.
In this contribution we present an overview of the different UV laser processes and compare the process results from ns, ps and fs lasers to give an outlook on future applications.
One of the most important issues in automotive industry is lightweight design, especially since the CO2 emission of new cars has to be reduced by 2020. Plastic and fiber reinforced plastics (e.g. CFRP and GFRP) receive besides new manufacturing methods and the employment of high-strength steels or non-ferrous metals increasing interest. Especially the combination of different materials such as metals and plastics to single components exhausts the entire potential on weight reduction. This article presents an approach based on short laser pulses to join such dissimilar materials in industrial applications.
Due to the steadily advancing miniaturization in all fields of technology nanostructuring becomes increasingly important.
Whereas the classical lithographic nanostructuring suffers from both high costs and low flexibility, for many applications
in biomedicine and technology laser based nanostructuring approaches, where near-field effects allow a sub-diffraction
limited laser focusing, are on the rise. In combination with ultrashort pulsed laser sources, that allow the utilization of
non-linear multi-photon absorption effects, a flexible, low-cost laser based nanostructuring with sub-wavelength
resolution becomes possible. Among various near-field nanostructuring approaches the microsphere based techniques,
which use small microbead particles of the size of the wavelength for a sub-diffraction limited focusing of pulsed laser
radiation, are the most promising. Compared to the tip or aperture based techniques this approach is very robust and can
be applied both for a large-scale production of periodic arrays of nanostructures and in combination with optical trapping
also for a direct-write. Size and shape of the features produced by microsphere near-field nanostructuring strongly
depend on the respective processing parameters. In this contribution a basic study of the influence of processing
parameters on the microsphere near-field nanostructuring with nano-, pico- and femtosecond laser pulses will be
presented. The experimental and numerical results with dielectric and metal nanoparticles on semiconductor and
dielectric substrates show the influence of particle size and material, substrate material, pulse duration, laser fluence,
number of contributing laser pulses and polarization on the structuring process.
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