This paper reports a novel freestanding stencil bi-material cantilever structure without sacrificial layer process in detail; the complexity and costs of fabrication process are reduced greatly. This type of microcantilever is made of two material layers (SiNx/Au), which is a 2dimension device, not a 3dimension one. The cantilevers and the support points are at the same plane in the stencil structure. MEMS sacrificial layer process problems are avoided completely in the process of the freestanding stencil bi-material cantilever microstructure so as to simplify process steps. Since two materials selected in the bi-material cantilever have a large mismatch in thermal conductivity and expansion coefficient, and all cantilevers in the device are freestanding completely, this kind of device is sensitive to a lot of physical varieties, such as thermal, infrared, mechanical vibration and electronic signals. This paper illuminates the total fabrication process of freestanding stencil bi-material cantilever structure; and in particular presents an application of uncooled infrared imaging system based on the novel freestanding bi-material cantilever structure in the final part of this paper.
This paper discusses lapping a metal mirror with solid abrasives at high speed. In this method there are three procedures. First the workpiece is ground in a grinding machine, which makes the surface roughness of the workpiece reach about Ra1.6micrometers . Second the workpiece is lapped roughly on a lapping machine, which makes the surface roughness of the workpiece reach about 0.1micrometers . Last the workpiece is lapped finely, which makes the surface roughness of the workpiece reach about Ra1nm. Because solid abrasives are used, the machining efficiency is very high. Each lapping procedure time is only about one minute. A high speed, high efficiency and accuracy machining is realized.
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