The surface defects (indentations, humps, scores) of semiconductor wafers are the major factor to affect the performance
of the semiconductor devices. Moreover, these defects make the manufacturing process difficult or yield of the
semiconductor devices decrease. Consequently, it is necessary to do an on-line wafers detection in the benefit of the
performance and yield of the devices. Thus, developing a way suited for practical detection is the urgent affair faced to
people. The optical methods are the most suited ways for surface defects detection because of their non-contact
operation. We discuss a relatively unknown method of the light reflex surface defects detection technology (Makyoh (or
magic-mirror) topography (MT)). The optical system that we designed achieves the detection mode of the parallel light
vertical incidence for the first time. It corrects the deviation between the tradition light path and arithmetic, promotes the
detection precision. A lot of experiments based on this optical system are taken to get the difference between the
detection modes of vertical incidence and the oblique incidence. The experiments prove that the vertical incidence mode
excels the oblique incidence mode. The MT images are also analyzed and disposed. The quantitative measurement can
be realized by digital image processing technology.
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