Dr. Weimin Ma Profile

Dr. Weimin Ma

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Publications (6)

Proceedings Article | 1 November 2007 Paper

Implementation of an efficient defect classification method in photomask mass production

Cathy Liu, Crystal Wang, Skin Zhang, Eric Guo, Steven Liu, Eric Haodong Lu, Dongsheng Fan, Den Wang, Weiming Ma

Proceedings Volume 6730, 67303P (2007) https://doi.org/10.1117/12.747189

KEYWORDS: Photomasks, Inspection, Reticles, Defect inspection, Logic, Crystals, Optical proximity correction, Defect detection, Lithography, Contamination

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Proceedings Article | 1 November 2007 Paper

To improve reticle re-qualification process and reduce reticle re-cleaning frequency using efficient defect classification and defect tracking

Eric Haodong Lu, Jim Wang, Raj Badoni, Ellison Chen, Weimin Ma

Proceedings Volume 6730, 67303Q (2007) https://doi.org/10.1117/12.747195

KEYWORDS: Air contamination, Reticles, Semiconducting wafers, Inspection, Remote sensing, Defect detection, Manufacturing, Lithography, Photomasks, Contamination

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Proceedings Article | 25 October 2007 Paper

Optimizing defect inspection strategy through the use of design-aware database control layers

Dvori Stoler, Wayne Ruch, Weimin Ma, Swapnajit Chakravarty, Steven Liu, Ray Morgan, John Valadez, Bill Moore, John Burns

Proceedings Volume 6730, 67303L (2007) https://doi.org/10.1117/12.747302

KEYWORDS: Inspection, Photomasks, Databases, Manufacturing, Defect inspection, Semiconducting wafers, Mask making, Computed tomography, Optical proximity correction, Control systems

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Proceedings Article | 4 November 2005 Paper

Implementation of reflected light die-to-die inspection and ReviewSmart to improve 65nm DRAM mask fabrication

Do Young Kim, Won Il Cho, Jin Hyung Park, Dong Hoon Chung, Byung Chul Cha, Seong Woon Choi, Woo Sung Han, Ki Hun Park, Nam Wook Kim, Carl Hess, Weimin Ma, David Kim

Proceedings Volume 5992, 599209 (2005) https://doi.org/10.1117/12.632338

KEYWORDS: Inspection, Defect detection, Photomasks, Contamination, Binary data, Defect inspection, Nanoimprint lithography, Deep ultraviolet, Semiconducting wafers, Mask making

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Proceedings Article | 28 June 2005 Paper

Implementation of an efficient defect classification methodology for advanced reticle inspection

Paul Yu, Vincent Hsu, Ellison Chen, Rick Lai, Kong Son, Weimin Ma, Peter Chang, Jackie Chen

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617488

KEYWORDS: Inspection, Reticles, Defect detection, Photomasks, Defect inspection, Manufacturing, Process engineering, Sensors, Image processing

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Proceedings Article | 17 December 2003 Paper

Investigation of smart inspection of critical layer reticles using additional designer data to determine defect significance

William Volk, Carl Hess, Wayne Ruch, Zongchang Yu, Weimin Ma, Lisa Fisher, Carl Vickery, Z. Mark Ma

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518071

KEYWORDS: Inspection, Reticles, Manufacturing, Photomasks, Prototyping, Metals, Semiconducting wafers, System on a chip, Transistors, Yield improvement

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With expected implementation of low k1 lithography on 193nm scanners for 65nm node wafer production, high resolution defect inspection will be needed to insure reticle quality and reticle manufacture process monitoring. Reticle cost and reticle defectivity are both increasing with each shrink to the next node. Simultaneously, system on chip (SoC) designs are increasing in which a large area of the exposure field typically contains dummy patterns and other features which are not electrically active. Knowing which defects will electrically impact device yield and performance can improve reticle manufacturing yield and cycle time -- resulting in lower reticle costs. This investigation examines the feasibility of using additional design data layers for die-to-database reticle inspection to determine in real time the relevance of a reticle defect by its location in the device (Smart InspectionTM). The impact to data preparation and inspection throughput is evaluated. The current prototype algorithm is built on the XPA and XPE die-to-database algorithms for chrome-on-glass and EPSM reticles, respectively. The algorithms implement variable sensitivity based on the additional design data regions. During defect review the defects are intelligently binned into the different predetermined design regions. Tests show the new Smart Inspection algorithm provides the capability of using higher than normal sensitivity in critical regions while reducing sensitivity in less critical regions to filter total defect counts and allow for the review of just defects that matter. Performance characterization of a variable sensitivity Smart Inspection algorithm is discussed in addition to the filtering of the total defect count during review to show the defects that matter to device performance. Using seven critical layer production reticles from a system on chip device we examine the applications of Smart Inspection by layer including active, poly, contact, metal and via layers. Data volume for additional data layers show little impact to inspection data prep time. The total area of the reticle where defects do not matter is as high as 70% on some layers. Review capabilities will be examined for various applications such as reviewing defects in the various regions such as SRAM, dummy pattern, and redundant contact/via specified regions. Lastly, the economics of Smart Inspection will be modeled using the collected knowledge of the applications from the production reticle characterized in this investigation.

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