Chris Rea, Werner Scholz, Lina Cao, Chubing Peng, Martin Blaber, Julius Hohfeld, Weibin Chen, Heidi Olson, Mourad Benakli, Hua Zhou, Pu-Ling Lu, Nils Gokemeijer, Mike Seigler, Kaizhong Gao, Alexander Wu, Jan-Ulrich Thiele, Ganping Ju, Edward Gage
Recent recording areal density and integrated drive performance demonstrations using Heat Assisted Magnetic
Recording (HAMR) suggest that it is a viable technology to succeed conventional magnetic recording. However
challenges still remain for the near field transducer, in particular reliability and sufficient thermal confinement. We
explore a new NFT design, Near field Transducer Gap (NTG), which offers the potential to mitigate some of the issues
in track confinement and thermal profile compared to earlier published studies [4]. The design offers efficiency
improvements, and the potential to reduce unwanted background light and heating that can lead to erasure in the writing
track, and neighbors.
KEYWORDS: Electron beam lithography, Optical simulations, Magnetism, Scattering, Point spread functions, Electron beams, Laser scattering, Head, Photoresist processing, Monte Carlo methods
The drive for higher magnetic storage density is correspondingly pushing to minimize the lithographic critical dimensions of the read/write components of thin film magnetic recording heads while maximizing the aspect ratio. Electron beam lithography can provide adequate resolution for research and development of magnetic heads. In this work, we present the experimental results of high aspect ratio trench patterning in 1.0-4.0 μm thick single-layer CAR resists with Leica VB6 operating at 50 keV. Although the maximum achievable aspect ratio in thick resist is limited by the forward scattering of the primary electron beam as it passes through the resist towards the resist-substrate interface, a sub-50 nm isolated top pole trench structure with an aspect ratio about 20:1 has been achieved by using e-beam SAFIER shrink process. To better understand the electron beam proximity effect on the resist profile in thick resists, electron beam simulation has been implemented. The theoretical limit of resist profiles has been predicted by simulation.
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