Mr. William H. Broadbent Profile

William H. Broadbent

Sr Manager/Reticle Inspection Product Marketing at KLA Corp

SPIE Involvement:

Author

Publications (22)

Proceedings Article | 22 January 2018 Paper

1X HP EUV reticle inspection with a 193nm inspection system

William Broadbent, Sterling Watson, Pei-Chun Chiang, Rui-Fang Shi, Jim-Ren Wang, Phillip Lim

Proceedings Volume 10451, 104510M (2018) https://doi.org/10.1117/12.2281354

KEYWORDS: Inspection, Reticles, Extreme ultraviolet, Defect detection, Semiconducting wafers, Particles, Data modeling, Photomasks, Databases, Extreme ultraviolet lithography

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Proceedings Article | 13 July 2017 Paper

MTO-like reference mask modeling for advanced inverse lithography technology patterns

Jongju Park, Jongin Moon, Suein Son, Donghoon Chung, Byung-Gook Kim, Chan-Uk Jeon, Patrick LoPresti, Shan Xue, Sonny Wang, Bill Broadbent, Soonho Kim, Jiuk Hur, Min Choo

Proceedings Volume 10454, 104540J (2017) https://doi.org/10.1117/12.2282406

KEYWORDS: Databases, Photomasks, Lithography, Inspection, Data processing

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Proceedings Article | 18 March 2016 Paper

Through-pellicle defect inspection of EUV masks using an ArF-based inspection tool

Dario Goldfarb, William Broadbent, Mark Wylie, Nelson Felix, Daniel Corliss

Proceedings Volume 9776, 97761H (2016) https://doi.org/10.1117/12.2218454

KEYWORDS: Inspection, Pellicles, Extreme ultraviolet, Photomasks, Defect inspection, Reticles, Semiconducting wafers, Modulation, Defect detection, Image analysis

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Proceedings Article | 23 October 2015 Paper

From nightmares to sweet dreams: inspection of aggressive OPC on 14nm reticles (and beyond) using a novel high-NA and low-NA dual method

Karen Badger, Michael Hibbs, Kazunori Seki, William Broadbent, Trent Hutchinson, Vincent Redding

Proceedings Volume 9635, 963511 (2015) https://doi.org/10.1117/12.2197729

KEYWORDS: Inspection, Photomasks, Reticles, Defect detection, Semiconducting wafers, Optical proximity correction, Databases, Lithography, SRAF, Printing

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Proceedings Article | 23 September 2013 Paper

Your worst nightmare: inspection of aggressive OPC on 14nm masks with emphasis on defect sensitivity and wafer defect print predictability

Karen Badger, Michael Hibbs, Jed Rankin, Kazunori Seki, Ian Stobert, Daniel Dechene, Ben Bleiman, Mini Ghosal, William Broadbent, Vincent Redding

Proceedings Volume 8880, 88800E (2013) https://doi.org/10.1117/12.2027307

KEYWORDS: Inspection, Photomasks, Semiconducting wafers, Reticles, Optical proximity correction, SRAF, Defect detection, Lithography, Critical dimension metrology, Opacity

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To prevent catastrophic failures during wafer manufacturing, mask manufacturers employ sophisticated reticle inspection systems to examine every image on every reticle to identify defects. These advanced systems inspect at resolutions typically 3x higher at the reticle-plane than advanced wafer scanners; thus enabling them to detect the small defects necessary to ensure reticle quality. The most thorough inspection is done using a reticle-to-database comparison that ensures the reticle pattern matches the design pattern. For high defect sensitivity, the database must be carefully modeled to exactly match the reticle pattern. Further, sub-resolution OPC shapes are often at the limit of the mask manufacturing process, which adds subtle variations on such shapes across the reticle. These modeling errors and process variations can cause high numbers of unwanted detections, thereby limiting inspection system defect detection sensitivity.[1] OPC designs are expected to become more aggressive for future generations and may stress the performance of current reticle inspection systems. To systematically assess the capability of various inspection approaches and identify needed areas for improvement, a new “Nightmare” test reticle has been designed by IBM. The test reticle contains various sizes and shapes of sub-resolution features that might appear on reticle generations from today’s 22nm to future 7nm. It also contains programmed defects to assess defect detection capability of current and future generation inspection systems. This paper will discuss the design of the “Nightmare” test reticle, and the inspection results of the current generation reticle inspection methods with emphasis on both inspectability and defect sensitivity. The subresolution features will be ranked according to importance for advanced OPC design. The reticle will also be evaluated using wafer print simulation so lithographic impact of features and defects can be measured and compared against inspection approaches and results.

Proceedings Article | 28 June 2013 Paper

EUV reticle inspection with a 193nm reticle inspector

William Broadbent, Gregg Inderhees, Tetsuya Yamamoto, Isaac Lee, Phillip Lim

Proceedings Volume 8701, 87010W (2013) https://doi.org/10.1117/12.2032553

KEYWORDS: Reticles, Extreme ultraviolet, Inspection, Defect detection, EUV optics, Databases, Data modeling, Semiconducting wafers, Extreme ultraviolet lithography, Particles

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Proceedings Article | 29 September 2010 Paper

Inspection of advanced computational lithography logic reticles using a 193-nm inspection system

Ching-Fang Yu, Mei-Chun Lin, Mei-Tsu Lai, Luke T.H. Hsu, Angus Chin, S. C. Lee, Anthony Yen, Jim Wang, Ellison Chen, David Wu, William Broadbent, William Huang, Zinggang Zhu

Proceedings Volume 7823, 78232F (2010) https://doi.org/10.1117/12.865604

KEYWORDS: Reticles, Inspection, SRAF, Semiconducting wafers, Computational lithography, Control systems, Defect detection, Databases, Model-based design, Optical proximity correction

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Proceedings Article | 8 June 2010 Paper

Results from a new 193nm die-to-database reticle inspection platform

William Broadbent, David Alles, Michael Giusti, Damon Kvamme, Rui-fang Shi, Weston Sousa, Robert Walsh, Yalin Xiong

Proceedings Volume 7748, 774828 (2010) https://doi.org/10.1117/12.868417

KEYWORDS: Reticles, Inspection, Extreme ultraviolet, Image resolution, Logic, Defect detection, Image transmission, EUV optics, Defect inspection, Image segmentation

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Proceedings Article | 11 May 2009 Paper

TeraScanXR: a high sensitivity and throughput photomask inspection system

Bo Mu, Aditya Dayal, Arosha Goonesekera, Phillip Lim, Chunlin Chen, Po Liu, Kevin Yeung, Becky Pinto, Bill Broadbent, Gregg Inderhees

Proceedings Volume 7379, 73792B (2009) https://doi.org/10.1117/12.824325

KEYWORDS: Inspection, Reticles, Sensors, Databases, Photomasks, Detection and tracking algorithms, SRAF, Logic, Imaging systems, Critical dimension metrology

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Proceedings Article | 24 March 2009 Paper

Results from prototype die-to-database reticle inspection system

Bo Mu, Aditya Dayal, Bill Broadbent, Phillip Lim, Arosha Goonesekera, Chunlin Chen, Kevin Yeung, Becky Pinto

Proceedings Volume 7272, 72723O (2009) https://doi.org/10.1117/12.815574

KEYWORDS: Prototyping, Inspection, Reticles, Sensors, Detection and tracking algorithms, Imaging systems, Logic, SRAF, Signal to noise ratio, Digital breast tomosynthesis

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Proceedings Article | 17 October 2008 Paper

Results from the KLA-Tencor TeraScanXR reticle inspection tool

Aditya Dayal, Bo Mu, Venkat Iyer, Phillip Lim, Arosha Goonesekera, Bill Broadbent

Proceedings Volume 7122, 71223G (2008) https://doi.org/10.1117/12.801831

KEYWORDS: Inspection, Reticles, Line edge roughness, Signal to noise ratio, Sensors, Detection and tracking algorithms, Spatial frequencies, Modulation transfer functions, Image processing, Defect detection

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Proceedings Article | 2 May 2008 Paper

Inspection results of advanced (sub-50nm design rule) reticles using the TeraScanHR

Jean-Paul Sier, William Broadbent, Paul Yu

Proceedings Volume 6792, 67920I (2008) https://doi.org/10.1117/12.798601

KEYWORDS: Inspection, Reticles, Databases, Defect detection, SRAF, 3D modeling, Data modeling, Image transmission, Logic, Optical proximity correction

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Proceedings Article | 25 October 2007 Paper

Inspection results for 32nm logic and sub-50nm half-pitch memory reticles using the TeraScanHR

Jean-Paul Sier, William Broadbent, Farzin Mirzaagha, Paul Yu

Proceedings Volume 6730, 67302A (2007) https://doi.org/10.1117/12.747295

KEYWORDS: Inspection, Reticles, Databases, Defect detection, SRAF, 3D modeling, Data modeling, Logic, Image transmission, Optical proximity correction

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Proceedings Article | 14 May 2007 Paper

Field results from a new die-to-database reticle inspection platform

William Broadbent, Ichiro Yokoyama, Paul Yu, Kazunori Seki, Ryohei Nomura, Heiko Schmalfuss, Jan Heumann, Jean-Paul Sier

Proceedings Volume 6607, 660714 (2007) https://doi.org/10.1117/12.728953

KEYWORDS: Reticles, Inspection, Image transmission, Image processing, Databases, SRAF, Defect detection, Sensors, Data modeling, Manufacturing

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Proceedings Article | 5 April 2007 Paper

Results from a new die-to-database reticle inspection platform

William Broadbent, Yalin Xiong, Michael Giusti, Robert Walsh, Aditya Dayal

Proceedings Volume 6518, 65182I (2007) https://doi.org/10.1117/12.712367

KEYWORDS: Reticles, Inspection, Image transmission, Databases, Imaging systems, Image processing, Data modeling, Defect detection, Optical proximity correction, Sensors

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Proceedings Article | 4 November 2005 Paper

Generating mask inspection rules for advanced lithography

Karen Badger, Bill Broadbent, Aditya Dayal, Emily Gallagher, ChingYun Hsiang, Vincent Redding

Proceedings Volume 5992, 599208 (2005) https://doi.org/10.1117/12.632478

KEYWORDS: Inspection, Photomasks, Databases, Opacity, Optical proximity correction, SRAF, Lithography, Product engineering, Reticles, Contamination

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Proceedings Article | 20 August 2004 Paper

Results from a new die-to-database reticle inspection platform

William Broadbent, James Wiley, Zain Saidin, Sterling Watson, David Alles, Larry Zurbrick, Chris Mack

Proceedings Volume 5446, (2004) https://doi.org/10.1117/12.557784

KEYWORDS: Reticles, Inspection, Sensors, Lithography, Databases, Quartz, Image transmission, Defect detection, Deep ultraviolet, Image processing

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Proceedings Article | 17 December 2003 Paper

Results from a new reticle defect inspection platform

William Broadbent, James Wiley, Zain Saidin, Sterling Watson, David Alles, Larry Zurbrick, Chris Mack

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518241

KEYWORDS: Reticles, Sensors, Inspection, Lithography, Defect detection, Image processing, Manufacturing, SRAF, Image transmission, Image resolution

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Proceedings Article | 16 August 2002 Paper

Measuring and assessing printability of reticle pinhole defects

Darren Taylor, Anthony Vacca, Larry Zurbrick, William Broadbent, Peter Fiekowsky

Proceedings Volume 4764, (2002) https://doi.org/10.1117/12.479355

KEYWORDS: Reticles, Scanning electron microscopy, Inspection, Semiconducting wafers, Manufacturing, Photomasks, Metrology, Inspection equipment, Calibration, Optics manufacturing

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Proceedings Article | 16 August 2002 Paper

Multibeam resolution die-to-database reticle inspection

William Volk, William Broadbent, Hector Garcia, Sterling Watson, Phillip Lim, Wayne Ruch

Proceedings Volume 4764, (2002) https://doi.org/10.1117/12.479351

KEYWORDS: Inspection, Reticles, Image transmission, Databases, Data modeling, Defect detection, Optical proximity correction, Algorithm development, Detection and tracking algorithms, Image processing

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Proceedings Article | 11 March 2002 Paper

Multibeam high-resolution die-to-database reticle inspection

William Volk, William Broadbent, Hector Garcia, Sterling Watson, Phillip Lim, Wayne Ruch

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458271

KEYWORDS: Inspection, Reticles, Image transmission, Databases, Data modeling, Defect detection, Optical proximity correction, Algorithm development, Detection and tracking algorithms, Image storage

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Proceedings Article | 11 March 2002 Paper

Improved method for measuring and assessing reticle pinhole defects

Darren Taylor, Anthony Vacca, Larry Zurbrick, William Howard, William Broadbent

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458300

KEYWORDS: Reticles, Scanning electron microscopy, Inspection, Semiconducting wafers, Manufacturing, Metrology, Lithography, Scanners, Photomasks, Wafer inspection

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