Prof. Wolfgang Benecke Profile

Prof. Wolfgang Benecke

at Fraunhofer-Institut für Siliziumtechnologie

SPIE Involvement:

Author

Publications (21)

Proceedings Article | 15 March 2016 Paper

Paper

Modeling of biaxial gimbal-less MEMS scanning mirrors

Thomas von Wantoch, Shanshan Gu-Stoppel, Frank Senger, Christian Mallas, Ulrich Hofmann, Thomas Meurer, Wolfgang Benecke

Proceedings Volume 9760, 976008 (2016) https://doi.org/10.1117/12.2213518

KEYWORDS: Mirrors, Microelectromechanical systems, Finite element methods, Scanners, Micromirrors, Computing systems, Modeling, Laser scanners, Systems modeling, Piezoelectric drives, Piezoelectric thin film actuators, 3D modeling, Control systems, Actuators

Read Abstract +

Proceedings Article | 27 February 2015 Paper

Paper

Centimeter-scale MEMS scanning mirrors for high power laser application

F. Senger, U. Hofmann, Thomas von Wantoch, C. Mallas, J. Janes, W. Benecke, Patrick Herwig, P. Gawlitza, Moises Ortega Delgado, C. Grune, J. Hannweber, A. Wetzig

Proceedings Volume 9375, 937509 (2015) https://doi.org/10.1117/12.2079600

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, High power lasers, Laser applications, Scanners, Modulation, Electrodes, Laser scanners, 3D scanning

Read Abstract +

Proceedings Article | 27 February 2015 Paper

Paper

Piezoelectrically driven translatory optical MEMS actuator with 7mm apertures and large displacements

H.- Quenzer, S. Gu-Stoppel, F. Stoppel, J. Janes, U. Hofmann, W. Benecke

Proceedings Volume 9375, 93750O (2015) https://doi.org/10.1117/12.2077101

KEYWORDS: Mirrors, Actuators, Spectrometers, FT-IR spectroscopy, Ferroelectric materials, Doppler effect, Semiconducting wafers, Microopto electromechanical systems, Silicon, Microelectromechanical systems

Read Abstract +

Proceedings Article | 27 February 2015 Paper

Paper

A study of integrated position sensors for PZT resonant micromirrors

S. Gu-Stoppel, H. Quenzer, Felix Heinrich, J. Janes, W. Benecke

Proceedings Volume 9375, 93750B (2015) https://doi.org/10.1117/12.2076764

KEYWORDS: Sensors, Ferroelectric materials, Micromirrors, Actuators, Platinum, Position sensors, Mirrors, Wheatstone bridges, Signal to noise ratio, Electronics

Read Abstract +

Proceedings Article | 7 March 2014 Paper

Paper

Two-dimensional scanning using two single-axis low-voltage PZT resonant micromirrors

S. Gu-Stoppel, J. Janes, H. Quenzer, U. Hofmann, W. Benecke

Proceedings Volume 8977, 897706 (2014) https://doi.org/10.1117/12.2036565

KEYWORDS: Micromirrors, Mirrors, Ferroelectric materials, Actuators, Silicon, Electromagnetism, Polarization, Finite element methods, Laser sources, Laser based displays

Read Abstract +

Proceedings Article | 7 March 2014 Paper

Paper

Analysis of capacitive sensing for 2D-MEMS scanner laser projection

Thomas von Wantoch, Christian Mallas, Ulrich Hofmann, Joachim Janes, Bernhard Wagner, Wolfgang Benecke

Proceedings Volume 8977, 897707 (2014) https://doi.org/10.1117/12.2038606

KEYWORDS: Capacitance, Micromirrors, Sensors, Mathematical modeling, Electrodes, Laser scanners, 3D scanning, Microelectromechanical systems, Analog electronics, Scanners

Read Abstract +

SPIE Journal Paper | 2 December 2013

Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning

Ulrich Hofmann, Mika Aikio, Joachim Janes, Frank Senger, Vanessa Stenchly, Juergen Hagge, Hans-Joachim Quenzer, Manfred Weiss, Thomas von Wantoch, Christian Mallas, Bernhard Wagner, Wolfgang Benecke

JM3, Vol. 13, Issue 01, 011103, (December 2013) https://doi.org/10.1117/12.10.1117/1.JMM.13.1.011103

KEYWORDS: Mirrors, Microelectromechanical systems, Laser scanners, Roads, Sensors, Laser development, Packaging, Wafer bonding, Actuators

Read Abstract +

Proceedings Article | 13 March 2013 Paper

Paper

Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning

U. Hofmann, M. Aikio, J. Janes, F. Senger, V. Stenchly, M. Weiss, H.-J. Quenzer, B. Wagner, W. Benecke

Proceedings Volume 8616, 86160C (2013) https://doi.org/10.1117/12.2006189

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Sensors, Glasses, Silicon, Packaging, Wafer bonding, Wafer-level optics, Neodymium

Read Abstract +

Proceedings Article | 9 March 2013 Paper

Paper

Piezoelectric resonant micromirror with high frequency and large deflection applying mechanical leverage amplification

S. Gu-Stoppel, J. Janes, D. Kaden, H. Quenzer, U. Hofmann, W. Benecke

Proceedings Volume 8612, 86120I (2013) https://doi.org/10.1117/12.2001620

KEYWORDS: Micromirrors, Actuators, Ferroelectric materials, Mirrors, Finite element methods, Electromagnetism, Silicon, Thin films, Silica, Microelectromechanical systems

Read Abstract +

Proceedings Article | 5 March 2013 Paper

Paper

New fabrication method of glass packages with inclined optical windows for micromirrors on wafer level

Vanessa Stenchly, Hans-Joachim Quenzer, Ulrich Hofmann, Joachim Janes, Björn Jensen, Wolfgang Benecke

Proceedings Volume 8613, 861319 (2013) https://doi.org/10.1117/12.2001760

KEYWORDS: Glasses, Semiconducting wafers, Silicon, Mirrors, Micromirrors, Wafer-level optics, Wafer bonding, Packaging, Surface roughness

Read Abstract +

For many applications it is inevitable to protect MEMS devices against environmental impacts like humidity which can affect their performance. Moreover recent publications demonstrates that micro mirrors can achieve very large optical scan angles at moderate driving voltages even exceeding 100 degrees when hermetically sealed under vacuum. While discrete chips may be evacuated and sealed on single die level using small can packages like TO housings, it is obvious that for high volume production a much more economical solution for the realisation of transparent optical packages already on wafer level must be developed. However, since any laser beam crossing a transparent glass surface is partly reflected even when anti-reflective coatings are applied, the construction of a wafer level optical housing suitable for laser projection purpose requires more than the integration of simple plane glass cap. The use of inclined optical windows avoids the occurrence of intense reflections of the incident laser beam in the projected images. This paper describes a unique technology to fabricate glass packages with inclined optical windows for micro mirrors on 8 inch wafers. The new process uses a high temperature glass forming process based on subsequent wafer bonding. A borosilicate glass wafer is bonded together with two structured silicon wafers. By grinding both sides of the wafer stack, a pattern of isolated silicon structures is defined. This preprocessed glass wafer is bonded thereon on a third structured silicon wafer, wherein the silicon islands are inserted into the cavities. By setting a defined pressure level inside the cavities during the final wafer bonding, the silicon glass stack extruded and it is out of plane during a subsequent annealing process at temperatures above the softening point of the glass. Finally the silicon is selectively removed in a wet etching process. This technique allows the fabrication of 8 inch glass wafers with oblique optical surfaces with surface roughness <1 nm and an evenness of < 300 nm.

Proceedings Article | 14 February 2011 Paper

Paper

MEMS scanning laser projection based on high-Q vacuum packaged 2D-resonators

U. Hofmann, C. Eisermann, H.-J. Quenzer, J. Janes, C. Schroeder, O. Schwarzelbach, B. Jensen, L. Ratzmann, T. Giese, F. Senger, J. Hagge, M. Weiss, B. Wagner, W. Benecke

Proceedings Volume 7930, 79300R (2011) https://doi.org/10.1117/12.878676

KEYWORDS: Mirrors, Microelectromechanical systems, Semiconducting wafers, Glasses, Scanners, Silicon, Wafer bonding, Packaging, Electrodes

Read Abstract +

Proceedings Article | 1 September 2005 Paper

Paper

Characteristics and electrical addressing of optical Fabry-Perot displays

T. Knieling, W. Lang, W. Benecke

Proceedings Volume 5875, 58750K (2005) https://doi.org/10.1117/12.615703

KEYWORDS: Fabry–Perot interferometers, Silicon, LCDs, Switching, Switches, Etching, Curium, Optical filters, Quartz, Video

Read Abstract +

Proceedings Article | 24 January 2004 Paper

Paper

Electrostatic actuated optical Fabry-Perot switches in passive matrix displays

Thomas Knieling, Meik Panitz, Wolfgang Benecke

Proceedings Volume 5348, (2004) https://doi.org/10.1117/12.523344

KEYWORDS: Switches, Silicon, Switching, Fabry–Perot interferometers, Refractive index, Mirrors, Reflectivity, Quartz, Dielectrics, Oxides

Read Abstract +

Proceedings Article | 16 January 2003 Paper

Paper

Electrostatic beam actuator for switching applications fabricated by Ni microelectroplating and thermal postprocessing

Mike Becker, Wolfgang Benecke, Birgit Hannemann, Thomas Henning

Proceedings Volume 4981, (2003) https://doi.org/10.1117/12.476281

KEYWORDS: Actuators, Heat treatments, Electroplating, Electrodes, Semiconducting wafers, Nickel, Microrelays, Prototyping, Etching, Switching

Read Abstract +

Proceedings Article | 15 January 2003 Paper

Paper

Fabrication of a porous membrane for gas precombustion

Joerg Stuermann, Andre Boedecker, Alexandra Splinter, Wolfgang Benecke

Proceedings Volume 4979, (2003) https://doi.org/10.1117/12.473377

KEYWORDS: Silicon, Gas sensors, Palladium, Chemical elements, Etching, Platinum, Wet etching, Carbon monoxide, Anisotropic etching, Gases

Read Abstract +

Proceedings Article | 21 November 2001 Paper

Paper

MEMS applications of porous silicon

Wolfgang Benecke, Alexandra Splinter

Proceedings Volume 4592, (2001) https://doi.org/10.1117/12.449009

KEYWORDS: Silicon, Etching, Semiconducting wafers, Microelectromechanical systems, Sensors, Silicon carbide, Gas sensors, Hydrogen, Metals, Scanning electron microscopy

Read Abstract +

Proceedings Article | 25 August 2000 Paper

Paper

Thick porous silicon sacrificial layer formation using implanted mask technology

Alexandra Splinter, Olaf Bartels, Wolfgang Benecke

Proceedings Volume 4174, (2000) https://doi.org/10.1117/12.396428

KEYWORDS: Silicon, Surface micromachining, Standards development, Bulk micromachining, Ions, Gas sensors

Read Abstract +

Proceedings Article | 25 August 2000 Paper

Paper

Novel porous silicon formation without external contact

Alexandra Splinter, Joerg Stuermann, Wolfgang Benecke

Proceedings Volume 4174, (2000) https://doi.org/10.1117/12.396459

KEYWORDS: Silicon, Etching, Metals, Chemical elements, Semiconducting wafers, HF etching, Bioalcohols

Read Abstract +

Proceedings Article | 31 August 1999 Paper

Paper

Additive electroplating technology as a new integration concept for MEMS

Josef Binder, Wolfgang Benecke

Proceedings Volume 3876, (1999) https://doi.org/10.1117/12.360494

KEYWORDS: Microelectromechanical systems, Sensors, Electroplating, Gyroscopes, Nickel, Switches, Resistance, Semiconducting wafers, Relays, Packaging

Read Abstract +

Proceedings Article | 10 March 1999 Paper

Paper

Electrostatically driven micromachined nickel resonators and gyroscopes

Olaf Renken, Wolfgang Benecke

Proceedings Volume 3680, (1999) https://doi.org/10.1117/12.341264

KEYWORDS: Nickel, Resonators, Gyroscopes, Plating, Photoresist materials, Electrodes, Semiconducting wafers, Gold, Protactinium, Microresonators

Read Abstract +

Proceedings Article | 4 October 1995 Paper

Paper

Etched bonded silicon wafers as test objects for the resolution power of subsurface voids

Klaus Kosbi, Siegfried Boseck, Ingo Albrecht, Steffen Schulze, Wolfgang Benecke

Proceedings Volume 2643, (1995) https://doi.org/10.1117/12.222763

KEYWORDS: Semiconducting wafers, Silicon, Acoustics, Wafer bonding, Microscopy, Interfaces, Ultrasonography, Wafer testing, Polishing, Solids

Read Abstract +

Showing 5 of 21 publications

Conference Committee Involvement (1)

Design, Test, Integration, and Packaging of MEMS/MOEMS

9 May 2000 | Paris, France

SIGN IN TO:

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Advertisement

Advertisement