Dr. Xingsheng Liu Profile

Dr. Xingsheng Liu

at Focuslight Technologies Inc

SPIE Involvement:

Author

Publications (49)

Proceedings Article | 8 November 2024 Paper

Picosecond MOPA laser system enhanced by novel micro-optic components

Chun He, Xingsheng Liu

Proceedings Volume 13232, 1323209 (2024) https://doi.org/10.1117/12.3035754

KEYWORDS: Picosecond phenomena, Oscillators, Mode locking, Pulsed laser operation, Laser systems engineering, Fiber lasers, Ultrafast phenomena, Pulse signals, Fiber amplifiers, Design

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Proceedings Article | 12 March 2024 Presentation + Paper

Novel fiber optic components for high efficiency fiber amplifiers

Chun He, Lei Gao, Yong Li, Kai Zhou, Xingsheng Liu

Proceedings Volume 12866, 1286607 (2024) https://doi.org/10.1117/12.3003323

KEYWORDS: Fiber amplifiers, Fiber lasers, Retroreflectors, Semiconductor lasers, Mirrors, Reflection, Fiber optics, Fiber optic components, Ions, Continuous wave operation

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Proceedings Article | 27 November 2023 Paper

High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, Xingsheng Liu

Proceedings Volume 12761, 127610N (2023) https://doi.org/10.1117/12.2687224

KEYWORDS: Semiconductor lasers, High power lasers, Laser soldering, Laser bonding, Reliability, Design and modelling, Surgery, Solid state lasers, Scientific research, Packaging

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Proceedings Article | 14 March 2023 Poster + Paper

905nm line-beam laser module with high reliability for automotive LiDAR applications

Yingmin Fan, Hao Zhang, Jiayan Yang, Peng Wang, Wenfang Zhang, Yixiao He, Xiaoyu Tian, Tuanwei Fu, Guopeng Zhang, Chung-en Zah, Xingsheng Liu

Proceedings Volume 12403, 124030T (2023) https://doi.org/10.1117/12.2650886

KEYWORDS: LIDAR, Beam divergence, Reliability, Design and modelling, Laser applications, Light sources, Laser bonding, Edge emitting semiconductor lasers, High power diode lasers, Laser sources

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Proceedings Article | 4 March 2022 Poster + Presentation + Paper

Development of diode laser stack with high power and long pulse width for medical aesthetic application

Junli Li, Tuanwei Fu, Dong Hou, Jingwei Wang, Yunzhu Chen, Yanfang Zheng, Chungen Zah, Xingsheng Liu

Proceedings Volume 11983, 119830R (2022) https://doi.org/10.1117/12.2608522

KEYWORDS: Semiconductor lasers, Resistance, Convection, Reliability, Laser development, Thermal modeling, Pulsed laser operation, Laser bonding, High power lasers

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Proceedings Article | 9 October 2021 Paper

VCSEL line-beam module for LiDAR applications

Yingmin Fan, Dandan Zhou, Hongtao Chong, Bin Zhao, Peng Wang, Ke Yuan, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910H (2021) https://doi.org/10.1117/12.2601496

KEYWORDS: Vertical cavity surface emitting lasers, LIDAR, Temperature metrology, Packaging, Optical design, Light sources, Transmitters, Prototyping, Spatial resolution, Sensors

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Proceedings Article | 9 October 2021 Paper

Research on VCSEL transmitter modules for intelligent driving

Dandan Zhou, Bin Zhao, Yingmin Fan, Hongtao Chong, Gang Wang, Peng Wang, Ke Yuan, Leon Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910S (2021) https://doi.org/10.1117/12.2601633

KEYWORDS: Vertical cavity surface emitting lasers, Transmitters, LIDAR, Temperature metrology, Light sources, Mirrors, Fiber optic illuminators, Light sources and illumination, Image transmission, Reliability

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Proceedings Article | 9 October 2021 Paper

Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder

Jingwei Wang, Tuanwei Fu, Dong Hou, Lijun Gao, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910D (2021) https://doi.org/10.1117/12.2602338

KEYWORDS: Semiconductor lasers, Packaging, High power diode lasers, Near field, Continuous wave operation, Heatsinks

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Proceedings Article | 11 March 2021 Open Access

Future Direction of High Power Diode Laser Technologies for Wide Applications and High Market Growth

Xingsheng Liu

Proceedings Volume 11768, 117680G (2021) https://doi.org/10.1117/12.2595748

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Proceedings Article | 5 March 2021 Poster + Paper

Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging

Yang Han, Lichen Sun, Tuanwei Fu, Lijun Gao, Yanfang Zheng, Yunzhu Chen, Xiaojuan Zhang, Minna Yan, Sicheng Zhao, Kai Yang, Lei Gao, Chungen Zah, Xingsheng Liu

Proceedings Volume 11668, 116680W (2021) https://doi.org/10.1117/12.2582695

KEYWORDS: Semiconductor lasers, Packaging, Reliability, Laser development, High power diode lasers, Solid state lasers, Resistance, High power lasers, Corrosion, Continuous wave operation

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Proceedings Article | 10 October 2020 Poster + Presentation + Paper

A high-performance annularly stacked laser diode pump for a solid state laser

Junli Li, Lichen Sun, Ming Liu, Yang Han, Tuanwei Fu, Lei Cai, Yanfang Zheng, Minna Yan, Juan Wang, Chunhua Tao, Lijun Gao, Jingwei Wang, Chungen Zah, Xingsheng Liu

Proceedings Volume 11545, 115450J (2020) https://doi.org/10.1117/12.2573534

KEYWORDS: Semiconductor lasers, Laser applications, Packaging, Laser development, Solid state lasers, Manufacturing, Laser systems engineering

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SPIE Journal Paper | 9 March 2020

Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress

Hongyou Zhang, Chung-en Zah, Xingsheng Liu

OE, Vol. 59, Issue 03, 036104, (March 2020) https://doi.org/10.1117/12.10.1117/1.OE.59.3.036104

KEYWORDS: Near field, Semiconductor lasers, Laser bonding, Copper, Silicon carbide, Aluminum nitride, Laser welding, Optical engineering, Near field optics, Beam shaping

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Proceedings Article | 21 February 2020 Presentation + Paper

High power 250W CW conductively cooled diode laser arrays with low-smile

Hongyou Zhang, Pengfei Zhu, Tuanwei Fu, Meiqin Li, Ning Lv, Wenwei Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11261, 112610C (2020) https://doi.org/10.1117/12.2540399

KEYWORDS: Packaging, High power lasers, Semiconductor lasers, Continuous wave operation, Laser bonding, Resistance

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Proceedings Article | 21 February 2020 Paper

Temperature distribution induced spectral broadening of high-power diode lasers

Di-Hai Wu, Pu Zhang, Bin Liu, Chung-En Zah, Xingsheng Liu

Proceedings Volume 11261, 1126113 (2020) https://doi.org/10.1117/12.2547159

KEYWORDS: Semiconductor lasers, High power lasers, 3D modeling, Thermal modeling, Mathematical modeling, Resistance, Packaging, Thermal effects

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Proceedings Article | 21 February 2020 Presentation + Paper

Diode pumped passively Q-switched Nd:YAG/Cr:YAG solid-state lasers with a stable output of millijoules at 1064 nm over a wide temperature range

Yingmin Fan, Chung-en Zah, Dihai Wu, Chen Gao, Yong Li, Xingsheng Liu

Proceedings Volume 11261, 112610N (2020) https://doi.org/10.1117/12.2543934

KEYWORDS: Laser crystals, Solid state lasers, Nd:YAG lasers, Temperature metrology, Q switched lasers, LIDAR, Q switching

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Proceedings Article | 19 November 2019 Paper

High-power low-smile vertically-stacked laser diode based on microchannel cooling

Hongyou Zhang, Lei Cai, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11182, 111820F (2019) https://doi.org/10.1117/12.2536518

KEYWORDS: High power lasers, Semiconductor lasers, Continuous wave operation, Diodes, Packaging, Laser applications, Glasses, Cladding

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Proceedings Article | 4 March 2019 Presentation + Paper

Development of high power annular diode laser array using hard solder

Dong Hou, Lichen Sun, Tuanwei Fu, Li Chen, Xuejie Liang, Lei Cai, Yan Yang, Jingwei Wang, Minna Yan, Chungen Zah, Xingsheng Liu

Proceedings Volume 10899, 108990A (2019) https://doi.org/10.1117/12.2510023

KEYWORDS: Semiconductor lasers, High power lasers, Packaging, Dielectrics, Optical simulations, Gallium arsenide, Copper, Laser development, Structural design, Optical isolators

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Proceedings Article | 4 March 2019 Paper

Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays

Hongyou Zhang, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10900, 109000T (2019) https://doi.org/10.1117/12.2506212

KEYWORDS: Packaging, Semiconductor lasers, High power lasers, Diodes, Laser bonding, Near field

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Proceedings Article | 4 March 2019 Presentation + Paper

Three-dimensional steady-state thermal model of a high power diode laser

Di-Hai Wu, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10899, 1089904 (2019) https://doi.org/10.1117/12.2506494

KEYWORDS: 3D modeling, Semiconductor lasers, High power diode lasers, Thermal modeling, Heat flux, Finite element methods, Resistance, Diffusion, Analytical research, Quantum wells

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Proceedings Article | 6 November 2018 Paper

A method of designing water-cooled horizontal array diode lasers for uniform junction temperature

Di-Hai Wu, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10812, 108120U (2018) https://doi.org/10.1117/12.2500701

KEYWORDS: Heatsinks, Semiconductor lasers, Resistance, Thermal effects, Solids, High power lasers, Computational fluid dynamics, 3D modeling

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Proceedings Article | 5 November 2018 Paper

Quasi-CW performance and reliability of dual laser bars on a micro-channel cooler

Hongyou Zhang, Li Chen, Sen Zhao, Boxue Wang, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10811, 108110F (2018) https://doi.org/10.1117/12.2327073

KEYWORDS: Laser bonding, Packaging, Semiconductor lasers, Reliability, High power lasers, Solid state lasers, Laser welding, Diodes, Indium, Optical simulations

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SPIE Journal Paper | 24 March 2018

Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler

Hongyou Zhang, Yangtao Jia, Wanshao Cai, Chunhua Tao, Chung-en Zah, Xingsheng Liu

OE, Vol. 57, Issue 03, 036115, (March 2018) https://doi.org/10.1117/12.10.1117/1.OE.57.3.036115

KEYWORDS: Near field, Laser bonding, Packaging, Semiconductor lasers, Copper, Optical simulations, High power lasers, Diodes, Near field optics, Optical engineering

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Proceedings Article | 20 February 2018 Presentation + Paper

Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics

Yingmin Fan, Jingwei Wang, Lei Cai, Thomas Mitra, Dirk Hauschild, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10513, 105130H (2018) https://doi.org/10.1117/12.2293612

KEYWORDS: Semiconductor lasers, Beam shaping, Micro optics, Light sources, Laser applications, Collimation, Cladding, High power diode lasers, Laser processing, Annealing

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Proceedings Article | 20 February 2018 Paper

High power multiple wavelength diode laser stack for DPSSL application without temperature control

Dong Hou, Xia Yin, Jingwei Wang, Shi Chen, Yun Zhan, Xiaoning Li, Yingmin Fan, Xingsheng Liu

Proceedings Volume 10513, 1051311 (2018) https://doi.org/10.1117/12.2291169

KEYWORDS: Semiconductor lasers, Absorption, Solid state lasers, Temperature metrology, Nd:YAG lasers, Crystals, Resistance, High power lasers, Laser development, Heatsinks

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Proceedings Article | 20 February 2018 Paper

Study on the near-field non-linearity (SMILE) of high power diode laser arrays

Hongyou Zhang, Yangtao Jia, Changxuan Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10513, 105131R (2018) https://doi.org/10.1117/12.2287580

KEYWORDS: Laser bonding, Indium, Laser welding, Optical simulations, Near field, Packaging, Semiconductor lasers, High power diode lasers, Copper, Near field optics

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Proceedings Article | 20 February 2018 Presentation + Paper

High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

Boxue Wang, Yangtao Jia, Haoyu Zhang, Shiyin Jia, Jindou Liu, Weifeng Wang, Xingsheng Liu

Proceedings Volume 10513, 105130Q (2018) https://doi.org/10.1117/12.2289259

KEYWORDS: Semiconductor lasers, Copper, Reliability, Continuous wave operation, Corrosion, High power lasers, Laser development, High power diode lasers, Ceramics, Resistance

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Proceedings Article | 22 February 2017 Presentation + Paper

Thermal characteristics of compact conduction-cooled high power diode laser array packages

Pu Zhang, Xingsheng Liu, Qiwen Zhu, Jingwei Wang

Proceedings Volume 10085, 100850A (2017) https://doi.org/10.1117/12.2250258

KEYWORDS: High power diode lasers, Packaging, Thermal effects, Thermal analysis, Semiconductor lasers, Ceramics, Finite element methods, Pulsed laser operation, Indium

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Proceedings Article | 22 February 2017 Paper

Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes

Hongyou Zhang, Xuejie Liang, Wanshao Cai, Chungen Zah, Xingsheng Liu

Proceedings Volume 10098, 1009829 (2017) https://doi.org/10.1117/12.2256112

KEYWORDS: High power lasers, Semiconductor lasers, Packaging, Diodes, Optoelectronic devices, Indium, Copper, Near field, Laser bonding, Continuous wave operation, Gallium arsenide

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Proceedings Article | 22 February 2017 Presentation + Paper

Optimization of microchannel cooler of high power diode laser array package

Dihai Wu, Pu Zhang, Zhiqiang Nie, Xuejie Liang, Jingwei Wang, Xingsheng Liu

Proceedings Volume 10085, 100850I (2017) https://doi.org/10.1117/12.2255693

KEYWORDS: Copper, Microfluidics, Solids, Fluid dynamics

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Proceedings Article | 22 February 2017 Presentation + Paper

Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

Jingwei Wang, Pengfei Zhu, Hui Liu, Xuejie Liang, Dihai Wu, Yalong Liu, Dongshan Yu, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10085, 1008504 (2017) https://doi.org/10.1117/12.2253442

KEYWORDS: Chemical weapons, Copper, Heatsinks, Near field

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Proceedings Article | 20 February 2017 Paper

High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology

Dongshan Yu, Xuejie Liang, Jingwei Wang, Xiaoning Li, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 10123, 101231A (2017) https://doi.org/10.1117/12.2250692

KEYWORDS: Semiconductor lasers, Laser applications, Reliability, Packaging, Laser development, Indium, High power lasers, Laser bonding, Corrosion, Copper, Pulsed laser operation, High power diode lasers, Gold, Thermal efficiency

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Proceedings Article | 20 February 2017 Presentation + Paper

Power degradation and reliability study of high-power laser bars at quasi-CW operation

Haoyu Zhang, Yong Fan, Hui Liu, Jingwei Wang, Chungen Zah, Xingsheng Liu

Proceedings Volume 10123, 101231E (2017) https://doi.org/10.1117/12.2256074

KEYWORDS: Failure analysis, Reliability, Semiconductor lasers, High power lasers, Continuous wave operation, Packaging, Pulsed laser operation, Mirrors, Near field, Quasi continuous wave operation, Solid state lighting

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Proceedings Article | 22 April 2016 Paper

High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, Xingsheng Liu

Proceedings Volume 9730, 973009 (2016) https://doi.org/10.1117/12.2213928

KEYWORDS: Semiconductor lasers, High power diode lasers, Laser development, Indium, Resistance, Reliability, High power lasers, Numerical simulations, Gold

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Proceedings Article | 22 April 2016 Paper

Packaging of hard solder 500W QCW diode laser array

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9730, 97300D (2016) https://doi.org/10.1117/12.2213977

KEYWORDS: Semiconductor lasers, Packaging, High power lasers, Reliability, Copper, Laser bonding, Near field, High power diode lasers, Laser systems engineering

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Proceedings Article | 26 February 2015 Paper

Characterization of far field of diode laser by three dimensional measurement

Hui Liu, Zhiyuan Yuan, Long Cui, Di Wu, Xingsheng Liu

Proceedings Volume 9346, 93461A (2015) https://doi.org/10.1117/12.2076548

KEYWORDS: Semiconductor lasers, 3D metrology, 3D image processing, Sensors, Error analysis, Spatial resolution, Photodiodes, Radium, Spherical lenses, Roads

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Proceedings Article | 20 February 2015 Paper

Advances in bonding technology for high power diode laser bars

Jingwei Wang, Xiaoning Li, Dong Hou, Feifei Feng, Yalong Liu, Xingsheng Liu

Proceedings Volume 9346, 934605 (2015) https://doi.org/10.1117/12.2079619

KEYWORDS: Semiconductor lasers, High power diode lasers, Indium, Liquids, Heatsinks, Reliability, Packaging, Laser bonding, Laser welding, Laser applications

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Proceedings Article | 20 February 2015 Paper

High power diode laser stack development using gold-tin bonding technology

Dong Hou, Jingwei Wang, Pu Zhang, Lei Cai, Ye Dai, Yingjie Li, Xingsheng Liu

Proceedings Volume 9346, 934604 (2015) https://doi.org/10.1117/12.2079610

KEYWORDS: Semiconductor lasers, Reliability, Laser development, Pulsed laser operation, Heatsinks, Indium, Packaging, High power diode lasers, High power lasers, Numerical simulations

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Proceedings Article | 20 February 2015 Paper

Effects of packaging on the performances of high brightness 9xx nm CW mini-bar diode lasers

Xiaoning Li, Jingwei Wang, Feifei Feng, Yalong Liu, Dongshan Yu, Pu Zhang, Xingsheng Liu

Proceedings Volume 9346, 93460C (2015) https://doi.org/10.1117/12.2080480

KEYWORDS: Semiconductor lasers, Indium, Packaging, Continuous wave operation, Polarization, Reliability, High power diode lasers, Heatsinks, Fiber lasers, Copper

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Proceedings Article | 20 February 2015 Paper

Effect of interface layer on the performance of high power diode laser arrays

Pu Zhang, Jingwei Wang, Lingling Xiong, Xiaoning Li, Dong Hou, Xingsheng Liu

Proceedings Volume 9346, 934607 (2015) https://doi.org/10.1117/12.2077029

KEYWORDS: High power diode lasers, Semiconductor lasers, Interfaces, Finite element methods, Packaging, Laser development, Numerical simulations, Thermal effects, Copper, Reliability

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Proceedings Article | 3 February 2015 Paper

Packaging of complete indium-free high reliable and high power diode laser array

Jingwei Wang, Xiaoning Li, Feifei Feng, Yalong Liu, Dong Hou, Xingsheng Liu

Proceedings Volume 9255, 92550X (2015) https://doi.org/10.1117/12.2072357

KEYWORDS: Semiconductor lasers, High power diode lasers, Packaging, Indium, Copper, Heatsinks, Reliability, Laser bonding, Optical simulations, Laser development

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SPIE Journal Paper | 21 October 2013

Double-cutting beam shaping technique for high-power diode laser area light source

Zhihua Huang, Lingling Xiong, Hui Liu, Zhenfu Wang, Pu Zhang, Zhiqiang Nie, Dihai Wu, Xingsheng Liu

OE, Vol. 52, Issue 10, 106108, (October 2013) https://doi.org/10.1117/12.10.1117/1.OE.52.10.106108

KEYWORDS: Prisms, Beam shaping, Semiconductor lasers, Light sources, High power lasers, Reflectors, Optical components, Optical simulations, Polarization, Fiber couplers

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Proceedings Article | 9 February 2012 Paper

3000W CW diode laser cladding system

Lingling Xiong, Min Wang, Xiaobiao Wang, Yanfang Zheng, Di Wu, Pu Zhang, Xiaoning Li, Zhenfu Wang, Xingsheng Liu

Proceedings Volume 8241, 824106 (2012) https://doi.org/10.1117/12.909599

KEYWORDS: Cladding, Semiconductor lasers, Laser systems engineering, Collimation, Laser processing, Nickel, Continuous wave operation, Polarization, Packaging, Lasers

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Proceedings Article | 9 February 2012 Paper

Hard solder 20-kW QCW stack array diode laser

Xiaoning Li, Lijun Kang, Jingwei Wang, Pu Zhang, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410C (2012) https://doi.org/10.1117/12.909772

KEYWORDS: Semiconductor lasers, High power lasers, Beam controllers, Reliability, Packaging, Beam shaping, Collimation, Copper, Thermal effects, Laser welding

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Proceedings Article | 9 February 2012 Paper

High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

Jingwei Wang, Lijun Kang, Pu Zhang, Zhiqiang Nie, Xiaoning Li, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410H (2012) https://doi.org/10.1117/12.909655

KEYWORDS: Semiconductor lasers, High power lasers, Laser welding, Packaging, Indium, Laser applications, Resistance, High power diode lasers, Continuous wave operation, Reliability

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Proceedings Article | 10 May 2007 Paper

A CTE matched, hard solder, passively cooled laser diode package combined with nXLT facet passivation enables high power, high reliability operation

Aaron Hodges, Jun Wang, Mark DeFranza, Xingsheng Liu, Bill Vivian, Curt Johnson, Paul Crump, Paul Leisher, Mark DeVito, Robert Martinsen, Jacob Bell

Proceedings Volume 6552, 65521E (2007) https://doi.org/10.1117/12.730700

KEYWORDS: Indium, Semiconductor lasers, Reliability, Diodes, High power lasers, Copper, Laser packaging, Temperature metrology, Laser development

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Proceedings Article | 28 February 2006 Paper

High-power distributed Bragg reflector lasers for green-light generation

Martin Hu, Hong Ky Nguyen, Kechang Song, Yabo Li, Nick Visovsky, Xingsheng Liu, Nobuhiko Nishiyama, Sean Coleman, Lawrence Hughes, Jacques Gollier, William Miller, Raj Bhat, Chung-En Zah

Proceedings Volume 6116, 61160M (2006) https://doi.org/10.1117/12.647840

KEYWORDS: Modulation, Second-harmonic generation, Thermal effects, Semiconductor lasers, High power lasers, Waveguides, Optical lithography, Wavelength tuning, Semiconductors, Distributed Bragg reflectors

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Proceedings Article | 7 June 2004 Paper

Progress in high-power fiber lasers

Venkata Bhagavatula, Rajaram Bhat, George Berkey, Xin Chen, Matthew Dejneka, Michael Gallagher, L. Hughes, Karl Koch, J. Koh, Ming-Jun Li, Victor Liu, Daniel Nolan, H. Rasmussen, Christine Tennent, Natesan Venkataraman, Donnell Walton, Jing Wang, Chung-En Zah, Luis Zenteno

Proceedings Volume 5335, (2004) https://doi.org/10.1117/12.541424

KEYWORDS: Fiber lasers, Cladding, High power fiber lasers, Polarization, Laser applications, Polymers, Glasses, Laser systems engineering, Laser development, Silica

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Proceedings Article | 12 May 2004 Paper

Semiconductor optical amplifier for amplification and switching applications

Martin Hu, Catherine Caneau, Herve LeBlanc, Victor Liu, Hong Nguyen, Nobuhiko Nishiyama, Sergio Tsuda, Chung-En Zah

Proceedings Volume 5280, (2004) https://doi.org/10.1117/12.529503

KEYWORDS: Semiconductor optical amplifiers, Polarization, Switching, Optical amplifiers, Fiber couplers, Vertical cavity surface emitting lasers, Fiber amplifiers, Switches, Modulation, Optical design

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Proceedings Article | 29 August 2002 Paper

Transient and static thermal behavior of high-power single-mode semiconductor lasers

Martin Hu, Xingsheng Liu, Chung-En Zah

Proceedings Volume 4905, (2002) https://doi.org/10.1117/12.480966

KEYWORDS: Resistance, Semiconductor lasers, High power lasers, Waveguides, Finite element methods, Laser packaging, Temperature metrology, Laser applications, Thermal effects, Semiconductors

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