Mr. Yugandhara R. Yadam Profile

Yugandhara R. Yadam

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Proceedings Article | 4 March 2022 Presentation + Paper

Nanosecond laser-assisted hybrid micro-scribing based fabrication of frequency selective surface

Sooraj Shiby, Yugandhara Yadam, Balamurugan Sivaprakasam, Kavitha Arunachalam, Nilesh Vasa

Proceedings Volume 11989, 119890T (2022) https://doi.org/10.1117/12.2609855

KEYWORDS: Copper, Dielectrics, Laser ablation, Pulsed laser operation, Electrodes, Ions, Fabrication, FSS based metamaterials, Chlorine, X band

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Micro-scale removal of Cu from a dielectric substrate has applications in microelectronics, patch antenna fabrication and frequency selective surface (FSS) manufacturing. Pulsed laser-based micro-scribing of Copper (Cu) from a dielectric is a preferred technique to avoid the adverse effects of chemical etching, such as toxicity and corrosive nature of the etchant, difficulty in fabrication of mask etc. However, pulsed laser-assisted removal of Cu from a dielectric in the air will produce recast layer/ redeposit, oxide layer near the ablation zone and thermal damage to the dielectric is another challenge. In this study, a hybrid technique with nanosecond laser-activated electrochemical micro-scribing of Cu is demonstrated. The technique was extended to remove 35 μm Cu from Rogers-RO4003 dielectric with a thickness ≈0.75 mm to fabricate FSS samples in X-band. The Cu-deposited dielectric substrate was immersed in Sodium Chloride (NaCl) solution, the laser beam was directed through a negatively biased tool electrode and the sample was biased positively. In this hybrid technique, along with laser-assisted material removal, laser-activated electrochemical etching also removed Cu selectively. The laser irradiation coupled with the NaCl solution induced preferential micro-etching, resulting in improved surface morphology without re-deposition and recast layer and thermal protection to the dielectric substrate. The FSS sample produced with the laser-hybrid micro-scribing was working at 10.3 GHz.

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