The SiO2-B2O3-La2O3-BaO glass has emerged as an important material due to its high performance. The effect of BaO content on the properties of SiO2-B2O3-La2O3-BaO glass such as density, thermal expansion coefficient, refractive index, and transmissivity were systematically studied. The results indicate that BaO content had influence on the density, refractive index and thermal expansion coefficient of the SiO2-B2O3-La2O3-BaO glass, BaO content did not have obvious impact on the transmissivity of SiO2-B2O3-La2O3-BaO glass.
In this paper, the finite element model of the fiber optic plates is established by using the finite element software. The simulation process is basically in line with the actual production process of the fiber optic plates. According to the simulation results, the deformation degree and speed of each part of the fiber optic plates in the process of melting pressure, as well as the changes of stress and strain of each part in the process of forming are analyzed. The results show that the deformation speed and degree of different parts are different in the process of melting pressure of fiber optic plates, especially the upper and lower end faces and side edges of fiber optic plates; and the stress and strain of each part are constantly changing, and the stress and strain values of the upper and lower end faces and side edges of fiber optic plates are larger than others.
Cracks in microchannel plate (MCP) seriously reduce the mechanical and electrical properties of MCP. The generation mechanism of cracks and the structure of sub-surface damage layer were revealed by studying the changes of surface morphology of MCP in optical process and chemical treatment process. The source of cracks appeared in the etching and reduction process is the sub-surface damage layer in the optical process. The damage layer includes cracks and non-uniform strain layer. After slicing, the depth of damage layer visible to optical microscope is within 25μm. During the polishing process, the damage layer is deeper, and there is a non-uniform strain layer with the depth of about 20μm. To avoid the occurrence of cracks, the thickness setting in the slicing process should take into account the slice damage layer, the polishing crack growth layer, and the strain layer.
Crack in microchannel plate (MCP) seriously reduces the mechanical and electrical properties of MCP. The mechanism of crack propagation in the chemical treatment process was revealed by studying the changes of crack morphology in acid-alkali etching and hydrogen reduction. The results show that during the acid-alkali etching process, the cracks on the channel material is dissolved by the dilute HNO3 and the cracks on the channel wall expands gradually under the etching of the NaOH solution. During the reduction process, cracks do not change significantly at the stage of heating. While at the stage of reaction with H2,the cracks are more easily expanded. The length of cracks does not change significantly after reduction. However, the surface near the cracks warps and the depth of cracks increases.
As an excellent two-dimensional electron multiplier device for transmission and enhancement of electronic image, microchannel plate (MCP) has the advantages of small volume, light weight, high resolution, high gain, low noise, low operating voltage, which plays an irreplaceable role in the fields of low-light-level night vision, space detection, nuclear detection, ultraviolet warning, medical image and so on. In recent years, with the continuous expansion of the application fields and the improvement of related manufacturing technologies, the performance requirements of MCP, especially the image quality, are getting higher and higher. 4G standard is the latest international requirements of image intensifier with FOM (Figure of Merit) reached more than 1800. Fixed pattern noise between multi-fibers of MCP is a common image defect. This defect not only increases the noise, reduces the signal-to-noise ratio, but also greatly interferes with the imaging quality, which has become a bottleneck problem restricting the improvement of FOM. This research is focused on the formation mechanism and control technology of fixed pattern noise between multi-fibers of MCP. The result shows that the formation mechanism of the fixed pattern noise between the multi-fibers is caused by the difference in microchannel structure, which leads to the difference in secondary electron yields between adjacent multi-fibers. Improving microchannel uniformity is an effective way to eliminate fixed pattern noise. The difference in microchannel structure is caused by the diameter deviation during fiber drawing. Through analysis and experimental measurement, it is found that the "heating-constant-cooling" zone of the drawing furnace has an optimal structure.
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