Millimeter Wave Subassembly Packaging Techniques

Harlan Howe Jr.

doi:10.1117/12.948257

24 October 1985 Millimeter Wave Subassembly Packaging Techniques

Harlan Howe Jr.

Proceedings Volume 0544, Millimeter Wave Technology III; (1985) https://doi.org/10.1117/12.948257
Event: 1985 Technical Symposium East, 1985, Arlington, United States

Abstract

Affordable Packaging Techniques usable at Millimeter wave frequencies, for application in radios, munitions, and missiles are discussed. Specific examples of several techniques are presented, and the interaction of these techniques with the emerging technology of monolithic millimeter wave integrated circuits is discussed.

Citation Download Citation

Harlan Howe Jr. "Millimeter Wave Subassembly Packaging Techniques", Proc. SPIE 0544, Millimeter Wave Technology III, (24 October 1985); https://doi.org/10.1117/12.948257

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