Paper
9 June 1988 Particle Model For Loose Abrasive Grinding
Rong-Seng Chang
Author Affiliations +
Proceedings Volume 0892, Simulation and Modeling of Optical Systems; (1988) https://doi.org/10.1117/12.944341
Event: 1988 Los Angeles Symposium: O-E/LASE '88, 1988, Los Angeles, CA, United States
Abstract
Grinding is modelled as a packing of particles connected by interparticle bonds that are characterized by a given force-displacement relation for the nomal and tangential components. Particles on the surface of the packing may be break or sheared off if the forces between particle contacts exceed the strength of the bonds. The forces between contacts due to surface fraction are calculated based on the principle of equilibrium and the compatibility between particles. The parking of particles is generally random and the surface friction including normal and shear stresses be a function of time (i.e. variable speed of grinder). The roughness of the surface is smoothed due to the "BREAK OFF" of surface particles. The mechanism is modelled microscopically to provide more insight to this phenomenon. The calculated results are compared and disscusseed with existing theories such as Prinston Equation to show its validity.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rong-Seng Chang "Particle Model For Loose Abrasive Grinding", Proc. SPIE 0892, Simulation and Modeling of Optical Systems, (9 June 1988); https://doi.org/10.1117/12.944341
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KEYWORDS
Particles

Polishing

Systems modeling

Computer simulations

Mathematical modeling

Surface finishing

Abrasives

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