Presentation + Paper
25 February 2017 Intracavity and extracavity-contacted 980-nm oxide-confined VCSELs for optical interconnects and integration
Philip Moser, Holger Schmeckebier, Marcin Gębski, Patrycja Śpiewak, Ricardo Rosales, Kilian Moser, Michał Wasiak, James A. Lott
Author Affiliations +
Abstract
Record-large modulation bandwidths of 30 GHz and larger have been achieved with state-of-the art directly and indirectly modulated VCSELs and VCSEL arrays. One next big challenge is to make VCSELs viable for integration onto silicon while maintaining large bandwidth values. Various integration schemes of VCSELs might require process variations potentially detrimental for large modulation bandwidths. We present and compare directly modulated oxide-confined top-emitting 980-nm VCSELs processed from one single epitaxial wafer design into four different extracavity and intracavity contact variations.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philip Moser, Holger Schmeckebier, Marcin Gębski, Patrycja Śpiewak, Ricardo Rosales, Kilian Moser, Michał Wasiak, and James A. Lott "Intracavity and extracavity-contacted 980-nm oxide-confined VCSELs for optical interconnects and integration", Proc. SPIE 10122, Vertical-Cavity Surface-Emitting Lasers XXI, 101220J (25 February 2017); https://doi.org/10.1117/12.2256177
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Vertical cavity surface emitting lasers

Semiconducting wafers

Resistance

Modulation

Wafer-level optics

Metals

Doping

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