Paper
14 September 2018 From turning to grinding: ductile machining with gPVA
C. Vogt, O. Fähnle, R. Rascher, M. Doetz, O. Dambon, F. Klocke
Author Affiliations +
Abstract
Grinding processes are usually set up experimentally, product-specifically and iteratively. The selected parameters are often based on empirical values, whereby the user can set very different parameters and achieve similar results.

In 2017, the so called “grinding process validation approach” (gPVA) was introduced to determine suitable parameter windows. The method allows the definition of parameter windows for grinding tools and materials. Parameter adjustments for optimum results are possible due to the experimentally determined dependence on specific chip volume and tool pressure.

The system was originally developed to describe brittle grinding processes on standard grinding machines. Tests on an ultra-precision lathe provide process parameter data on ductile mode machining of tungsten carbide using UPM machines. This paper reports on gPVA being applied to transfer the ductile machining process from UPM machineries to a standard CNC grinding machine.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Vogt, O. Fähnle, R. Rascher, M. Doetz, O. Dambon, and F. Klocke "From turning to grinding: ductile machining with gPVA", Proc. SPIE 10742, Optical Manufacturing and Testing XII, 107420I (14 September 2018); https://doi.org/10.1117/12.2323246
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KEYWORDS
Tungsten

Lens grinding equipment

Single point diamond turning

Diamond machining

Surface finishing

Polishing

Abrasives

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