High-throughput additive manufacturing of thiol-based, oxygen-insensitive photoresins with digital micromirror devices (Conference Presentation)

Walter Voit; Benjamin Lund; Stephen Kay; Daniel Zamorano; Caleb Lund

doi:10.1117/12.2511496

4 March 2019 High-throughput additive manufacturing of thiol-based, oxygen-insensitive photoresins with digital micromirror devices (Conference Presentation)

Walter Voit, Benjamin Lund, Stephen Kay, Daniel Zamorano, Caleb Lund

Author Affiliations +

Proceedings Volume 10932, Emerging Digital Micromirror Device Based Systems and Applications XI; 109320A (2019) https://doi.org/10.1117/12.2511496
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

We are developing photopolymer resins with a toughness exceeding 25 MJ/m3, with a strain capacity of >200%, which are low odor, and which can be additively manufactured into a mesh of effective density <50 kg/m3 with individual strut thickness of <250 µm. We are optimizing placement of individual Digital Micromirror Device (DMD) chips (visual field overlap, optics train, staggering, rotation) in LightBars™, which consist of arrays of up to 64 DMDs with sufficient overlap to cure part layers at an anticipated 10 mm/sec to cover 500 mm wide at a voxel resolution of <200 µm such that each voxel is “patterned” by >1,000 different mirrors. Different resins have been tailored with different additive cocktails for rapid manufacturing at different wavelengths ranging from 355 nm to 385 nm to 405 nm.

Conference Presentation

Citation Download Citation

Walter Voit, Benjamin Lund, Stephen Kay, Daniel Zamorano, and Caleb Lund "High-throughput additive manufacturing of thiol-based, oxygen-insensitive photoresins with digital micromirror devices (Conference Presentation)", Proc. SPIE 10932, Emerging Digital Micromirror Device Based Systems and Applications XI, 109320A (4 March 2019); https://doi.org/10.1117/12.2511496

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