Particle distribution characterization on material removal uniformity in chemical mechanical polishing

Shijie Zhao; Ruiqing Xie; Defeng Liao; Xianhua Chen; Qinghua Zhang; Jian Wang; Qiao Xu

doi:10.1117/12.2536289

15 November 2019 Particle distribution characterization on material removal uniformity in chemical mechanical polishing

Shijie Zhao, Ruiqing Xie, Defeng Liao, Xianhua Chen, Qinghua Zhang, Jian Wang, Qiao Xu

Proceedings Volume 11175, Optifab 2019; 111750A (2019) https://doi.org/10.1117/12.2536289
Event: SPIE Optifab, 2019, Rochester, New York, United States

Abstract

Chemical mechanical polishing (CMP) is the most important process for global planarization. The micro material removal and planarization of the optical surface is a complicated process, and the surface shape of optics is effected by kinematics, pressure, and chemical conditions. Moreover, it is a remarkable fact that the distribution characterization of polishing particles also has an important effect on material removal uniformity, especially for leather pad and Tin polishing lap. Large optics were always polished to a convex shape for the low density of valid abrasives in optic center. The porosity and grooves distribution of pad plays a major role in slurry delivering. The novel model of contact and material removal is presented in which pad characterization, and polishing particles delivery and distribution effects are included. With the modified pad asperity and optimized grooves, the particles have been inclined towards well-distributed, and experiments validated that the optic figure is significantly promoted.

Conference Presentation

Citation Download Citation

Shijie Zhao, Ruiqing Xie, Defeng Liao, Xianhua Chen, Qinghua Zhang, Jian Wang, and Qiao Xu "Particle distribution characterization on material removal uniformity in chemical mechanical polishing", Proc. SPIE 11175, Optifab 2019, 111750A (15 November 2019); https://doi.org/10.1117/12.2536289

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