Microelectromechanical Devices: An Overview

George A. Hazelrigg

doi:10.1117/12.962933

9 November 1989 Microelectromechanical Devices: An Overview

George A. Hazelrigg

Proceedings Volume 1167, Precision Engineering and Optomechanics; (1989) https://doi.org/10.1117/12.962933
Event: 33rd Annual Technical Symposium, 1989, San Diego, United States

Abstract

Recent advances in the technology of silicon micro-fabrication, building upon the fabrication technologies of microelectronics, have led to a capability for the fabrication of micromechanical components and devices that can be incorporated on a silicon chip, along with electronic components. Early products using this technology are already on the market. They use passive mechanical structures, such as diaphragms for pressure transducers or cantilever beams for accelerometers. During the summer of 1988, a rotating electrostatic micromotor was fabricated and operated, and it is now expected that sensors with active micromechanical components will be developed. This technology offers the possibility of fabricating complex mechanical systems at extremely low cost, and it could lead to a major new industry.

Citation Download Citation

George A. Hazelrigg "Microelectromechanical Devices: An Overview", Proc. SPIE 1167, Precision Engineering and Optomechanics, (9 November 1989); https://doi.org/10.1117/12.962933

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available