Laser processing of transparent materials, particularly deep hole machining, has been extensively studied from the viewpoint of its industrial use. This time, we tried to improve the processing depth by laser ablation processing for back surface of fused silica glass using a picosecond laser with a wavelength of 532 nm. The numerical aperture of lens was 0.4, and the laser was focused on the back surface of the glass. In addition, the input laser was divided into double pulses and compared with the processing results of a single pulse. As a result, it was shown that the processing depth of back surface ablation is higher than that of surface ablation. It was also found that by using a double-pulse that sets the first laser to a laser output below the fluence threshold and the second laser to the laser over the threshold, a deeper processing depth can be obtained. At the same time, when the shapes of the processing traces were observed, the processing traces were not a simple concave-shaped hole, but a donutshaped processing traces with a raised center. In double-pulse laser processing where the first laser is set above the threshold, we find that the processing traces show traces that are close to single-pulse traces.
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