Packaging Of Semiconductor Optical Amplifiers

Robert A. Boudreau; Joanne S. LaCourse

doi:10.1117/12.963340

5 January 1990 Packaging Of Semiconductor Optical Amplifiers

Robert A. Boudreau, Joanne S. LaCourse

Proceedings Volume 1177, Integrated Optics and Optoelectronics; (1990) https://doi.org/10.1117/12.963340
Event: OE/FIBERS '89, 1989, Boston, United States

Abstract

Semiconductor optical amplifier packaging is described using a localized cooling soldering approach for attaching and aligning two separate single mode fibers. The alignment process is more critical for amplifiers than for lasers because fiber coupling loss directly reduces any gain achieved by the semiconductor. The localized cooling method permits use of the same solder at each fiber attachment point eliminating the need for a higher temperature step solder approach. The alignment efficiency or ability of the package to maintain an attached fiber positionally compared to an unattached aligned fiber appears equivalent to what is achievable with laser packages. A description of special issues and problems relevant to the packaging of amplifiers is also presented.

Citation Download Citation

Robert A. Boudreau and Joanne S. LaCourse "Packaging Of Semiconductor Optical Amplifiers", Proc. SPIE 1177, Integrated Optics and Optoelectronics, (5 January 1990); https://doi.org/10.1117/12.963340

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