Ultrafast laser singulation of optical circuits with optical quality end-facets

Jason R. Grenier; Lars Brusberg; Chad C. Terwilliger; Kristopher A. Wieland

doi:10.1117/12.2613420

4 March 2022 Ultrafast laser singulation of optical circuits with optical quality end-facets

Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Kristopher A. Wieland

Proceedings Volume 11991, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXII; 1199109 (2022) https://doi.org/10.1117/12.2613420
Event: SPIE LASE, 2022, San Francisco, California, United States

Abstract

There are significant advantages for on-board and co-packaged optics in next-generation data centers. However, the highvolume manufacturing of the photonic circuits that underpin the technology will require the fabrication of large quantities on a wafer- or panel-scale, which must then be singulated into individual devices. A major challenge is the requirement for low-loss edge coupling to optical fibers (optical-quality and vertical end-facets) which typically requires expensive and time-consuming post-processing steps such as mechanical polishing. In this work, an ultrafast laser is employed to singulate glass substrates using a non-diffracting beam that creates a localized material modification through the entire glass thickness via nonlinear laser-material interactions. By controlling the placement of the laser modifications, the regions around the waveguides could be strategically avoided. This leaves optical-quality regions around the waveguides which provide the same low-loss edge coupling as the polished end-facets. This process can be applied to optical circuits containing planar ion-exchanged waveguides and 3D ultrafast laser-inscribed waveguides in the bulk glass without the need for post-polishing the end-facet and thus opens the opportunity for more rapid device prototyping and lower-cost high-volume manufacturing.

Conference Presentation

Citation Download Citation

Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, and Kristopher A. Wieland "Ultrafast laser singulation of optical circuits with optical quality end-facets", Proc. SPIE 11991, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXII, 1199109 (4 March 2022); https://doi.org/10.1117/12.2613420

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available