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15 February 2022 Package structure design of 64×64 InGaAs/InP SPAD assembly
Rui Yang
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Proceedings Volume 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021); 1216625 (2022) https://doi.org/10.1117/12.2614489
Event: Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 2021, Hong Kong, Hong Kong
Abstract
In this study, the package structure of 64×64 InGaAs/InP single photon avalanche diode (SPAD) was analyzed and designed. The vacuum package shell which contains 104 pins is made of kovar alloy (4J29). The shell window is a typical glass-to-metal structure, which consist of a metal base part and a glass window part (sapphire). W-Cu heat sink was used for the extraction of heat generated by the chips and the thermoelectric cooler (TEC). Micro lens array (MLA) was used to concentrate the light to improve the light absorption efficiency. The chips were mounted on a AlN ceramic substrate, which is used as a wire bonding buffer layer, as well as a good heat dissipation channel. A three-stage TEC was used to stabilize the SPAD working temperature at about 210K. Schematic diagram of the wire bonding designs, and the main technological process steps of package were also given.
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Rui Yang "Package structure design of 64×64 InGaAs/InP SPAD assembly", Proc. SPIE 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 1216625 (15 February 2022); https://doi.org/10.1117/12.2614489
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KEYWORDS
Structural design
Packaging
Single photon
Single photon detectors
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