Presentation + Paper
13 March 2023 Hybrid laser integration in the mid-IR for silicon photonics sensing applications
Colin J. Mitchell, Ahmed Osman, Ke Li, Jordi S. Panadés, Milos Nedeljkovic, Longqi Zhou, Kristian M. Groom, Jon Heffernan, Goran Mashanovich
Author Affiliations +
Proceedings Volume 12426, Silicon Photonics XVIII; 1242608 (2023) https://doi.org/10.1117/12.2650054
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
Quantum Cascade Lasers operating between 5.7 and 5.9 μm have been integrated on to a Germanium-on-Silicon (GoS) platform by flip-chip bonding. Sensing in this wavelength region is useful for a wide range of applications from monitoring caffeine and sweeteners, to analysis of oestrogen composition, which plays an important role in the metastatic spread of breast cancer. The approach demonstrated here uses laser bars incorporating twenty-four separate laser sources. Further enhancements of this system from the first generation are presented, including real-time power monitoring of the QCL output via fibrecoupling, more efficient gratings, improved support-structures and process improvements for both the QCL and GoS.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Colin J. Mitchell, Ahmed Osman, Ke Li, Jordi S. Panadés, Milos Nedeljkovic, Longqi Zhou, Kristian M. Groom, Jon Heffernan, and Goran Mashanovich "Hybrid laser integration in the mid-IR for silicon photonics sensing applications", Proc. SPIE 12426, Silicon Photonics XVIII, 1242608 (13 March 2023); https://doi.org/10.1117/12.2650054
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KEYWORDS
Quantum cascade lasers

Waveguides

Etching

Laser bonding

Design and modelling

Silicon photonics

Laser bars

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