Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV

Yi-Pei Tsai; Yi-Han Chang; Jane Wang; Darko Trivkovic; Kurt Ronse; Ryoung-Han Kim

doi:10.1117/12.2658866

28 April 2023 Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV

Yi-Pei Tsai, Yi-Han Chang, Jane Wang, Darko Trivkovic, Kurt Ronse, Ryoung-Han Kim

Proceedings Volume 12495, DTCO and Computational Patterning II; 124951U (2023) https://doi.org/10.1117/12.2658866
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

A yield prediction model with a corresponding cost of the ownership (CoO) and turn-around-time (TAT) analysis is studied on imec’s advanced technology nodes that include EUV and high NA EUV lithography. It also captures device variations from FinFET to CFET. Using modeled die-yield and the cost-of-ownership (CoO) for imec advanced technology nodes including N2, A14, A10, A7 to A5 technology nodes, we show there is a clear correlation trend in choosing a process technology. A precise methodology that can co-model the turn-around-time (TAT) which is inseparable in evaluating the manufacturability is also provided. As a conclusion, node-to-node scalability is proven to be a function of the manufacturability which will be represented to the yield, CoO and TAT metric, not just a function of the patterning complexity or photolithographic resolution that the industry is mainly chasing after.

Citation Download Citation

Yi-Pei Tsai, Yi-Han Chang, Jane Wang, Darko Trivkovic, Kurt Ronse, and Ryoung-Han Kim "Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV", Proc. SPIE 12495, DTCO and Computational Patterning II, 124951U (28 April 2023); https://doi.org/10.1117/12.2658866

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