Presentation + Paper
12 June 2023 Composite bond line measurements based on a Bayesian analysis of flash thermography data
Author Affiliations +
Abstract
For bonded composite materials, an accurate characterization of the adhesive bond line is needed to predict failure modes and fracture toughness. In this paper, bond line thickness was estimated from data obtained using through transmission flash thermography. The forward model that predicts back surface temperature is based on a three layer heat diffusion equation with varying diffusivity and flux boundary conditions. The corresponding inverse problem of estimating bond line thickness from measurement data was solved using a Bayesian approach that assumed Gaussian priors for the bond line thickness and thermal diffusivity of the adherends. Finally, the outputs of the thermography based method were compared to measurements that were collected using a micrometer and ultrasound testing.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter W. Spaeth, Joseph N. Zalameda, James W. Bisgard, Tyler B. Hudson, Rodolfo I. Ledesma, and Ricardo A. Huertas "Composite bond line measurements based on a Bayesian analysis of flash thermography data", Proc. SPIE 12536, Thermosense: Thermal Infrared Applications XLV, 125360G (12 June 2023); https://doi.org/10.1117/12.2662824
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KEYWORDS
Thermography

Thermal modeling

Composites

Adhesives

Data modeling

Infrared cameras

Inverse problems

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