Analysis of IC10 alloy joint solidification and the role of B and Hf in TLP diffusion welding

Qi Li; Haitao Gao; Fengmei Liu; Yupeng Zhang; Huang He

doi:10.1117/12.2673996

9 March 2023 Analysis of IC10 alloy joint solidification and the role of B and Hf in TLP diffusion welding

Qi Li, Haitao Gao, Fengmei Liu, Yupeng Zhang, Huang He

Proceedings Volume 12600, International Conference on Optoelectronic Materials and Devices (ICOMD 2022); 126000L (2023) https://doi.org/10.1117/12.2673996
Event: 2022 International Conference on Optoelectronic Materials and Devices, 2022, Chongqing, China

Abstract

In this study, the drop-melting elements B and Hf were added to the alloy material for TLP diffusion welding, and the solidification behavior of IC10 alloy joint was analyzed, and the growth mechanism of γ, γ' and related compounds in TLP connection was explored. The results shows that element B was distributed in the grain boundary of the ISZ region, which increases the binding force of the grain boundary and increases the strength of the grain boundary. As a melting element, Hf element affects the liquid phase line temperature of the middle layer and makes the co-crystal liquid phase have good fluidity. The content of Hf elements has a great influence on the widening stage of the liquid phase area, which increases the dissolution amount of the base material, increases the weld width, and increases the liquid phase metal of the weld, which increases the difficulty of isothermal solidification of the weld and increases the time. When the isothermal solidification is completed, the TLP joint tissue only achieves the local tissue composition homogeneity, and continues to extend the thermal insulation time, which is conducive to the further diffusion of the alloy elements.

Citation Download Citation

Qi Li, Haitao Gao, Fengmei Liu, Yupeng Zhang, and Huang He "Analysis of IC10 alloy joint solidification and the role of B and Hf in TLP diffusion welding", Proc. SPIE 12600, International Conference on Optoelectronic Materials and Devices (ICOMD 2022), 126000L (9 March 2023); https://doi.org/10.1117/12.2673996

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KEYWORDS

Chemical elements

Solids

Liquids

Tissues

Alloys

Diffusion

Chemical composition

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