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28 June 2023 Investigation into machining characteristics of silicon carbide ceramics using ultrasonic vibration-assisted grinding method
Jianguo Cao, Zhengzhao Li
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Proceedings Volume 12720, 2022 Workshop on Electronics Communication Engineering; 127200T (2023) https://doi.org/10.1117/12.2675100
Event: 2022 Workshop on Electronics Communication Engineering (WECE 2022), 2022, Xi'an, China
Abstract
Difficult-to-machining materials are widely used in industry, due to their excellent material properties. However, the ultra-precision machining of difficult-to-machining is difficulty issue, due to their properties of super hard and super brittle. Ultrasonic assisted machining has a prominent role in processing difficult materials, because it combines the advantages of traditional processing and ultrasonic vibration. In this paper, ultrasonic assisted grinding processing method was used to machining silicon carbide material, using a self-made machining equipment, to explore the processing characteristics of ultrasonic assisted grinding in the processing of difficult-to-machining materials.
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Jianguo Cao and Zhengzhao Li "Investigation into machining characteristics of silicon carbide ceramics using ultrasonic vibration-assisted grinding method", Proc. SPIE 12720, 2022 Workshop on Electronics Communication Engineering, 127200T (28 June 2023); https://doi.org/10.1117/12.2675100
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KEYWORDS
Silicon carbide
Ultrasonics
Ceramics
Vibration
Surface roughness
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