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17 August 2023 Efficient coupling interface for hybrid integration of DFB lasers on 3μm SOI waveguide platform
Dongsheng Lv, Chenyang Liu, Yanyue Ding, Aimin Wu
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Proceedings Volume 12757, 3rd International Conference on Laser, Optics, and Optoelectronic Technology (LOPET 2023); 127570A (2023) https://doi.org/10.1117/12.2690369
Event: 3rd International Conference on Laser, Optics and Optoelectronic Technology (LOPET 2023), 2023, Kunming, China
Abstract
An optical coupling interface is a crucial component in Silicon Photonics (SiPh) technology for optical signal transmission. It is widely utilized to achieve on-chip light sources and optical input/output for SiPh chips. In this work, we report a coupling interface with a focusing structure based on the 3μm SOI waveguide platform to minimize mode profile mismatch, resulting in a high coupling efficiency and relatively large -1dB alignment tolerances across a wide bandwidth. Simulation results show that our design achieved a high transmission of greater than -0.85dB across the 1500-1600nm range, with a maximum of -0.847dB. When the laser is positioned 1.5μm away from the waveguide facet, the -1dB tolerances are ±0.62μm and ±0.45μm in the horizontal and vertical directions, respectively. Additionally, the interface is safe for lasers as it has a return loss (caused by reflection) of less than -30dB.
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Dongsheng Lv, Chenyang Liu, Yanyue Ding, and Aimin Wu "Efficient coupling interface for hybrid integration of DFB lasers on 3μm SOI waveguide platform", Proc. SPIE 12757, 3rd International Conference on Laser, Optics, and Optoelectronic Technology (LOPET 2023), 127570A (17 August 2023); https://doi.org/10.1117/12.2690369
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KEYWORDS
Waveguides
Interfaces
Tolerancing
Design and modelling
Silicon
Laser bonding
Light sources
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