Poster + Paper
12 March 2024 Comparison of plate type cylindrical lens-based and VCSEL-based flat-top beams used in large area laser selective reflow for microelectronics industry applications
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Conference Poster
Abstract
PCB substrate size has been increased and its thickness has been decreased for cost reduction and integration of various functions in advanced semiconductor packaging and removing the humidity from the paste applied to large-area electrode of rechargeable battery has become important. To perform bonding processes for these substrates and semiconductor chips or remove the humidity from top surface to deep layer in the paste applied during making the electrode of Rechargeable Battery, the local heating using a large area flat-top laser beam is required. In this presentation, two types of large area flat-top beams obtained by plate-type cylindrical lens and VCSEL (Vertical-Cavity Surface Emitting Laser) based flat-top beams are compared and discussed. Several key characteristics such as beam uniformity, beam steepness, beam size variability, the power in the flat-top region and others are compared.
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Nam Seong Kim, Young Soo Han, and Young Jin Lee "Comparison of plate type cylindrical lens-based and VCSEL-based flat-top beams used in large area laser selective reflow for microelectronics industry applications", Proc. SPIE 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, 128720E (12 March 2024); https://doi.org/10.1117/12.3000126
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KEYWORDS
Vertical cavity surface emitting lasers

Industry

Laser applications

Laser bonding

Semiconductors

Industrial applications

Microelectronics

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