PCB substrate size has been increased and its thickness has been decreased for cost reduction and integration of various functions in advanced semiconductor packaging and removing the humidity from the paste applied to large-area electrode of rechargeable battery has become important. To perform bonding processes for these substrates and semiconductor chips or remove the humidity from top surface to deep layer in the paste applied during making the electrode of Rechargeable Battery, the local heating using a large area flat-top laser beam is required. In this presentation, two types of large area flat-top beams obtained by plate-type cylindrical lens and VCSEL (Vertical-Cavity Surface Emitting Laser) based flat-top beams are compared and discussed. Several key characteristics such as beam uniformity, beam steepness, beam size variability, the power in the flat-top region and others are compared.
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