A novel flow of full-chip OPC model calibration and verification by utilizing SEM image contours

Yuan Gan; Changlian Yan; Mengqing Yu; Penghui Zhu; Jing Qiao; Lile Lu; Shengrui Zhang; Ming Ding; Chunying Han; Weijie Shi; Xiaojun Luo; Junhai Jiang; Zongchang Yu

doi:10.1117/12.3010034

10 April 2024 A novel flow of full-chip OPC model calibration and verification by utilizing SEM image contours

Yuan Gan, Changlian Yan, Mengqing Yu, Penghui Zhu, Jing Qiao, Lile Lu, Shengrui Zhang, Ming Ding, Chunying Han, Weijie Shi, Xiaojun Luo, Junhai Jiang, Zongchang Yu

Author Affiliations +

Proceedings Volume 12954, DTCO and Computational Patterning III; 129540K (2024) https://doi.org/10.1117/12.3010034
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Contour-based OPC modeling has recently arisen as an alternative to the conventional CD-based method. In this work, an innovative flow is proposed to improve the quality of the final calibrated model by using SEM image contours. Layout pattern sampling technique should be introduced into this flow, which could not only ensure adequate coverage including IPS and pattern diversity, but also minimize the data collection effort. In this study, we have developed an automated high-precision contour extraction method to obtain good and reliable contours that were in good agreement with traditional CD-SEM measurements. The OPC model calibration was built by using the high-precision SEM contours, and we compared the contour-based method with conventional CD measurements. Finally, the model error RMS of the calibration and verification process could be fed back to the layout pattern sampling, which could benefit the sustainable improvement of the predictive ability of the model.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yuan Gan, Changlian Yan, Mengqing Yu, Penghui Zhu, Jing Qiao, Lile Lu, Shengrui Zhang, Ming Ding, Chunying Han, Weijie Shi, Xiaojun Luo, Junhai Jiang, and Zongchang Yu "A novel flow of full-chip OPC model calibration and verification by utilizing SEM image contours", Proc. SPIE 12954, DTCO and Computational Patterning III, 129540K (10 April 2024); https://doi.org/10.1117/12.3010034

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