Paper
6 February 2024 Study of compatibility of FC-72 with several common packing and sealing materials
Yongsheng Xu, Bing Luo, Jie Tang, Zhidu Huang, Zhimei Cui
Author Affiliations +
Proceedings Volume 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023); 129791I (2024) https://doi.org/10.1117/12.3015816
Event: 9th International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 2023, Guilin, China
Abstract
There are some uncertainties about the compatibility of FC-72 with PI and PEEK as well as Nitrile Butadiene Rubber (NBR), fluororubber (FKM) and silicone sealing materials. This paper provides a test platform for liquid FC-72 to carry out compatibility test with test materials. By carrying out compatibility reaction between materials and periodically recording the quality change of test materials, the compatibility between different materials and FC-72 can be determined.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Yongsheng Xu, Bing Luo, Jie Tang, Zhidu Huang, and Zhimei Cui "Study of compatibility of FC-72 with several common packing and sealing materials", Proc. SPIE 12979, Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023), 129791I (6 February 2024); https://doi.org/10.1117/12.3015816
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KEYWORDS
Fluorine

Silicon

Mixtures

Packaging

Equipment

Liquids

Dielectrics

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