Interferometric moire analysis of wood and paper structures

James B. Hyzer; Jim Shih; Robert E. Rowlands

doi:10.1117/12.57421

1 December 1991 Interferometric moiré analysis of wood and paper structures

James B. Hyzer, Jim Shih, Robert E. Rowlands

Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991) https://doi.org/10.1117/12.57421
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Moiré interferometry was used here to determine fundamental engineering information of cellulosic (wood, paper) structures. Cyclic creep and fracture behavior of paperboard, and the displacements (strains) in bolted connectors in wood were analyzed with up to 61,000 ℓpi moiré interferometry.

Citation Download Citation

James B. Hyzer, Jim Shih, and Robert E. Rowlands "Interferometric moiré analysis of wood and paper structures", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.57421

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