Paper
1 January 1992 Cluster tool technology
John R. Hauser, Syed A. Rizvi
Author Affiliations +
Proceedings Volume 1594, Process Module Metrology, Control and Clustering; (1992) https://doi.org/10.1117/12.56620
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
A review is presented of cluster tool concepts, their potential advantages for future IC manufacturing, approaches to cluster tools and cluster tool technologies. As wafer size increases and device feature size decreases, cluster tools should play a more central role in future IC manufacturing, although there are several problems to be overcome before cluster tools are available for a broad spectrum of IC technologies.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John R. Hauser and Syed A. Rizvi "Cluster tool technology", Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); https://doi.org/10.1117/12.56620
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Semiconducting wafers

Process control

Manufacturing

Etching

Oxides

Lithography

Plasma

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