Paper
1 December 1991 Threshold measurements in laser-assisted particle removal
Shyan Jer Lee, Kamran Imen, Susan Davis Allen
Author Affiliations +
Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51020
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
Laser assisted particle removal (LAPR) is a novel technique capable of removing particulate contamination from solid surfaces. LAPR uses an energy transfer medium which preferentially absorbs into capillary spaces under and around the particles on the contaminated substrate. Laser irradiation causes explosive evaporation of the energy transfer medium via absorption into the energy transfer medium itself or the substrate/particle system with subsequent conductive heat transfer. The explosive force propels particles off the substrate much like a small rocket engine. In our experiments, LAPR was used to remove 9.5 micrometers Al2O3, 5 micrometers Al2O3, and 1 micrometers polystyrene particles from Si surfaces at the wavelengths of 10.6 micrometers and 9.6 micrometers using water as the energy transfer medium. At these wavelengths the laser energy is absorbed predominantly in the water. Laser removal thresholds (J/cm2) were obtained using a degenerate threshold model. The temperature rise in the energy transfer medium was estimated, suggesting that superheating of the absorbed water is a reasonable mechanism for LAPR.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shyan Jer Lee, Kamran Imen, and Susan Davis Allen "Threshold measurements in laser-assisted particle removal", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51020
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Cited by 7 scholarly publications.
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KEYWORDS
Particles

Laser damage threshold

Water

Energy transfer

Pulsed laser operation

Silicon

Absorption

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