Bonding layer effects on the actuation mechanism of an induced strain actuator/substructure system

Mark W. Lin; Craig A. Rogers

doi:10.1117/12.175221

6 May 1994 Bonding layer effects on the actuation mechanism of an induced strain actuator/substructure system

Mark W. Lin, Craig A. Rogers

Proceedings Volume 2190, Smart Structures and Materials 1994: Smart Structures and Intelligent Systems; (1994) https://doi.org/10.1117/12.175221
Event: 1994 North American Conference on Smart Structures and Materials, 1994, Orlando, FL, United States

Abstract

An integrated induced-strain actuator/substructure system requires a third-phase adhesive layer to provide bond between the adherends. The presence of the adhesive, which in general has relatively low stiffness and strength, brings about concern regarding losses in transferring the actuation mechanism from the actuator to the substructure and bonding failure regarding structural integrity. In this paper, an analytical model for an integrated actuator/adhesive/substructure system is developed to study the adhesive layer effects. The model is formulated on the basis of the theory of elasticity and solved by the principle of stationary complementary energy. The solution obtained is, in an approximate manner, in closed form. The results show that a relatively thick and/or compliant adhesive causes noticeable losses in the transfer of the actuation mechanism, particularly in the end zone near the actuator edges. Nevertheless, such an adhesive yields low interfacial shear and peeling stresses which are beneficial to the structural integrity.

Citation Download Citation

Mark W. Lin and Craig A. Rogers "Bonding layer effects on the actuation mechanism of an induced strain actuator/substructure system", Proc. SPIE 2190, Smart Structures and Materials 1994: Smart Structures and Intelligent Systems, (6 May 1994); https://doi.org/10.1117/12.175221

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