Paper
19 September 1995 In-situ particle monitoring: today's technology drivers
Peter Borden, Martin Elzingre, Derek Aqui
Author Affiliations +
Abstract
In situ particle monitors (ISPMs) have seen rapidly increased acceptance in semiconductor production because they provide automated, 100% inspection of particle levels during process at a low cost per inspection point. As productivity enhancement tools, ISPM use is only justified when it increases productivity of the host tool. The sensors provide an indirect measure of wafer contamination, and are of greatest value when they provide a particle count that correlates to yield and has identifiable causes. Manufacturing integration has now become the key factor driving the future of ISPM technology. This paper will discuss some of these factors, including correlation, sensor placement, impact on sensor design, application of expertise to qualification and maintenance, and gauge capability.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Borden, Martin Elzingre, and Derek Aqui "In-situ particle monitoring: today's technology drivers", Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); https://doi.org/10.1117/12.221302
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KEYWORDS
Particles

Sensors

Manufacturing

Semiconducting wafers

Inspection

Plasma

Very large scale integration

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