Design and fabrication of micromachined electron guns (MEGs) usinga multiple-level planar tungsten process

Wolfgang Hofmann; Liang-Yuh Chen; Noel C. MacDonald

doi:10.1117/12.222640

26 September 1995 Design and fabrication of micromachined electron guns (MEGs) using a multiple-level planar tungsten process

Wolfgang Hofmann, Liang-Yuh Chen, Noel C. MacDonald

Author Affiliations +

Proceedings Volume 2640, Microlithography and Metrology in Micromachining; (1995) https://doi.org/10.1117/12.222640
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

We report on the fabrication and design of micro-machined electron guns (MEGs). The fabrication relies entirely on standard integrated circuit technology and allows the fabrication of large MEG arrays. Silicon field emitters are formed by thermal oxidation and the self- aligned submicron aperture gate electrode is fabricated using selective chemical vapor deposition of tungsten. Additional levels of tungsten electrodes are integrated using the selective tungsten multiple-level planar process. We present a brief review of the fabrication sequence, discuss the electro-mechanical and electron-optical design issues and present specific designs.

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Wolfgang Hofmann, Liang-Yuh Chen, and Noel C. MacDonald "Design and fabrication of micromachined electron guns (MEGs) using a multiple-level planar tungsten process", Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); https://doi.org/10.1117/12.222640

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