Steps towards the use of DSPI for high-temperature strain measurement

Petra Aswendt; Roland Hoefling

doi:10.1117/12.250740

18 September 1996 Steps toward the use of DSPI for high-temperature strain measurement

Petra Aswendt, Roland Hoefling

Proceedings Volume 2782, Optical Inspection and Micromeasurements; (1996) https://doi.org/10.1117/12.250740
Event: Lasers, Optics, and Vision for Productivity in Manufacturing I, 1996, Besancon, France

Abstract

This paper describes a systematic study of influences that have to be overcome for the application of interferometry in the high temperature range. A specially designed test facility including an optical arrangement is used for the investigation of CMC specimens. Verification tests are performed up to 1500 degree(s)C with combined thermal-mechanical load sets. The fringe quality achieved allows to evaluate a field of displacement and strain data. Experimental experience gained is convincing to reach even higher temperatures and to test CMC components as well.

Citation Download Citation

Petra Aswendt and Roland Hoefling "Steps toward the use of DSPI for high-temperature strain measurement", Proc. SPIE 2782, Optical Inspection and Micromeasurements, (18 September 1996); https://doi.org/10.1117/12.250740

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