Metrology automation reliability

Elizabeth E. Chain

doi:10.1117/12.250846

12 September 1996 Metrology automation reliability

Elizabeth E. Chain

Proceedings Volume 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II; (1996) https://doi.org/10.1117/12.250846
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

At Motorola's MOS-12 facility automated measurements on 200- mm diameter wafers proceed in a hands-off 'load-and-go' mode requiring only wafer loading, measurement recipe loading, and a 'run' command for processing. Upon completion of all sample measurements, the data is uploaded to the factory's data collection software system via a SECS II interface, eliminating the requirement of manual data entry. The scope of in-line measurement automation has been extended to the entire metrology scheme from job file generation to measurement and data collection. Data analysis and comparison to part specification limits is also carried out automatically. Successful integration of automated metrology into the factory measurement system requires that automated functions, such as autofocus and pattern recognition algorithms, display a high degree of reliability. In the 24- hour factory reliability data can be collected automatically on every part measured. This reliability data is then uploaded to the factory data collection software system at the same time as the measurement data. Analysis of the metrology reliability data permits improvements to be made as needed, and provides an accurate accounting of automation reliability. This reliability data has so far been collected for the CD-SEM (critical dimension scanning electron microscope) metrology tool, and examples are presented. This analysis method can be applied to such automated in-line measurements as CD, overlay, particle and film thickness measurements.

Citation Download Citation

Elizabeth E. Chain "Metrology automation reliability", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); https://doi.org/10.1117/12.250846

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KEYWORDS

Reliability

Semiconducting wafers

Pattern recognition

Metrology

Scanning electron microscopy

Optical alignment

Detection and tracking algorithms

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