Planar surface-micromachined pressure sensor with a subsurface, embedded reference pressure cavity

William P. Eaton; James H. Smith

doi:10.1117/12.250711

17 September 1996 Planar surface-micromachined pressure sensor with a subsurface, embedded reference pressure cavity

William P. Eaton, James H. Smith

Proceedings Volume 2882, Micromachined Devices and Components II; (1996) https://doi.org/10.1117/12.250711
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. FUrthermore, CMP adds additional design flexibility. The senors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms. Process details are discussed and characteristics from many devices are presented.

Citation Download Citation

William P. Eaton and James H. Smith "Planar surface-micromachined pressure sensor with a subsurface, embedded reference pressure cavity", Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); https://doi.org/10.1117/12.250711

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