Nondestructive evaluation of bonding strength of silver soldered bits for civil engineering works

Naotake Ohtsuka; Yasunori Shindo; Kuninari Miyagawa; Shigeru Kimura

doi:10.1117/12.259210

15 November 1996 Nondestructive evaluation of bonding strength of silver soldered bits for civil engineering works

Naotake Ohtsuka, Yasunori Shindo, Kuninari Miyagawa, Shigeru Kimura

Proceedings Volume 2948, Nondestructive Evaluation for Process Control in Manufacturing; (1996) https://doi.org/10.1117/12.259210
Event: Nondestructive Evaluation Techniques for Aging Infrastructure and Manufacturing, 1996, Scottsdale, AZ, United States

Abstract

In this paper the bonding area of silver soldered tungsten cemented carbide bits was evaluated nondestructively by using electric potential and ultrasonic methods and was compared with the bonding strength measured by shearing off test. In the electric potential method, voltage was measured by changing a distance of electric terminals which were connected across the bonding plane. In the ultrasonic method, a transducer was attached to a lubricated tip surface and the amplitude of back surface echo signals was measured. It was concluded that the electric potential method is considered to be applicable as a primary nondestructive inspection of the bits by improving the configuration of tip of the terminals and applying constant contact pressure. The ultrasonic method can be used to certify the caught bits in a net of the primary inspection.

Citation Download Citation

Naotake Ohtsuka, Yasunori Shindo, Kuninari Miyagawa, and Shigeru Kimura "Nondestructive evaluation of bonding strength of silver soldered bits for civil engineering works", Proc. SPIE 2948, Nondestructive Evaluation for Process Control in Manufacturing, (15 November 1996); https://doi.org/10.1117/12.259210

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